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2024年12月27日发(作者：python项目实践)

专利内容由知识产权出版社提供

专利名称：SUBSTRATE STRUCTURE

发明人：Chih-Hong Chuang

申请号：US12955887

申请日：20101129

公开号：US2A1

公开日：20120412

专利附图：

摘要：A substrate structure including a first metal substrate, a second metal

substrate, a frame fixture, a first conductive layer, a second conductive layer, a first

adhesive layer and a second adhesive layer is provided. The second metal substrate is

stacked over the first metal substrate. The frame fixture is disposed around the first

metal substrate and the second metal substrate. The first adhesive layer is disposed

between the first conductive layer and the first metal substrate, and between the first

conductive layer and the frame fixture. The first conductive layer is fixed on an upper

surface of the frame fixture by the first adhesive layer. The second adhesive layer is

disposed between the second conductive layer and the second metal substrate, and

between the second conductive layer and the frame fixture. The second conductive layer

is fixed on a lower surface of the frame fixture by the second adhesive layer.

申请人：Chih-Hong Chuang

地址：Hsinchu TW

国籍：TW

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