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2024年12月27日发(作者：it培训中心北京市)

专利内容由知识产权出版社提供

专利名称：Substrate processing apparatus and

substrate processing method

发明人：大津 孝彦,▲高▼山 和也

申请号：JP2018005157

申请日：20180116

公开号：JP2019125692A

公开日：20190725

专利附图：

摘要：A substrate processing apparatus capable of improving the processing quality

of a substrate. A processing tank that stores a processing liquid for processing a

substrate, a processing liquid supply unit that supplies the processing liquid to the inside

of the processing tank, and a processing liquid supply unit that supplies the processing

liquid to the inside of the processing tank. A temperature adjusting unit that adjusts the

temperature of the processing liquid, a temperature measuring unit that measures the

temperature of the processing liquid stored in the processing tank, and a temperature

measured by the temperature measuring unit become a set temperature. As described

above, a temperature control unit that controls the temperature adjusting unit, a stirring

unit that stirs the processing liquid stored in the processing tank, and a change that is

stored in the processing tank after the set temperature is changed. A substrate

processing apparatus comprising: an agitation control unit that agitates the processing

liquid stored in the processing tank by the agitation unit before the substrate is

immersed in the processing liquid. [Selection] Figure 5

申请人：東京エレクトロン株式会社

地址：東京都港区赤坂五丁目３番１号

国籍：JP

代理人：伊東 忠重,伊東 忠彦

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