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2024年12月27日发(作者：网站模板图片素材)

专利内容由知识产权出版社提供

专利名称：CIRCUIT SUBSTRATE AND CIRCUIT DEVICE

发明人：INOHARA KAZUAKI,井之原 和明

申请号：JP2014219345

申请日：20141028

公开号：JP2016085163A

公开日：20160519

专利附图：

摘要：PROBLEM TO BE SOLVED: To provide a circuit substrate that allows a probe to

be tightly connected to a ON: A circuit substrate has: an insulation

substrate 1; a plurality of terminals 2 which has a long side and short side, is arrayed on a

top face 1 of the insulation substrate so that the long sides oppose each other, and to

which a probe 6 is connected; and a dummy terminal 3 that is arranged along the long

side of at least one located at an end of the array of the plurality of terminals 2 and apart

from the long side thereof on the top face of the insulation substrate 1. Heat is

externally discharged from the terminal 2 via the dummy terminal 3, and thereby a heat

stress to be applied to the terminal 2 is reduced, which in turn can curb peeling of the

terminal 2 from the insulation substrate ED DRAWING: Figure 1

申请人：KYOCERA CORP,京セラ株式会社

地址：京都府京都市伏見区竹田鳥羽殿町６番地

国籍：JP

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