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2024年12月27日发(作者：javaswing计算机)
technicalspecificationofcopper-basedccl
taiwanplain
usbergquist
substrate
peeling
strength(n/mm）
insulation
resistance（¦Ø）
breakdown
voltage（vdc）
soakable
japannrk
sustrate
therma
conductive
substrate
3
>100*10g
6k
300
℃,1min,no
soldering（℃/m）
bubble;no
thermal
conductivity
（w/m-k）
thermal
resistance（℃
/w）
combustibility
dielectric
constant（1mhz）
dielectricloss
angle(tangent)
fv-o
6
0.02
fv-o
6
0.02
fv-o
5
0.02
fv-o
4
0.03
fv-o
5
0.02
<0.45<0.45<1<1.2<0.45
>1.8>1.8>1.2>0.8>1.8
3
>10*10g
5.5k
300
℃,1min,no
bubble,no
2.2
>10*10g
5k
300
℃,1min,no
bubble,no
domestic
1060
substrate
1.8
>1*10g
4k
280
℃,1min,no
bubble,no
2.2
>10*10g
6k
288
℃,1min,no
bubble,no
oursubstrate
delaminationdelaminationdelaminationdelaminationdelamination
items
productmodel
materialmodel
surfacedisposal
layers
alsubstrate
domestical
technicalindex
cusubstrate
importedaldomesticcuimportedcu
a1100a5052a6061a6063c1100
spraytin/chemicaltin/chemicalgold/osp/immersiontin
single-sidealsubstrate/double-sidealsubstrate
/four-layeralsubstrate
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maximummeasurement
minimummeasurement
linewidth/space
warpandtwist
processingthickness
copperfoilthickness
moldingdimension
tolerance
1100mm*480mm
5mm*5mm
0.1mm
¡Ü0.5%(thickness:1.6mm,
measurement:300mm×300mm)
0.3－4.5mm
35um70um105um140um
±0.15mm
v-cutpositioningaccuracy±0.1mm
processingcapability
cuthicknessofinner
aperture
aperturelocationdeviation±0.076mm
minimumdiameterof
piercing
lowerthan1.0mm
1.2-3.0mm1.5mm
1.0mm
6000m
2
20-25um
minimumspecificationof
platethicknesslowerthan1.0mm0.8mm×0.8mm
thesquaregroove
circuitprintingdeviation
scopeofmolding
dimensiontolerance
miniaperture0.8mmnotlimitedtothemaximumaperturediameter
goldplating：ni2.5-5umau0.05-0.1um0.025－0.075um
coatingthicknessimmersiongold：ni5-8umau0.08-0.1um
spraytin3-30um4-30um
v－cutangledeviation
scopeofv-cutplates
markingfontofthe
smallestcomponent
smallestwindowingofpad0.01mm
±5°
0.6mm-3.2mm
0.15mm
platethickness1.2-3.0mm1.0×1.0mm
±0.076mm
cnc：±0.1mmpunchingtheshape：±0.15mm
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