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2024年12月27日发(作者：百度云搜索引擎入口)

专利内容由知识产权出版社提供

专利名称：Underfill dispense at substrate aperture

发明人：Charles Anthony Odegard,Marvin Wayne

Cowens,Leon Stiborek

申请号：US11109259

申请日：20050419

公开号：US2A1

公开日：20061019

专利附图：

摘要：Disclosed are methods for dispensing underfill material in an IC assembly

having a die mounted on a substrate with a gap therebetween. One or more aperture is

provided in the substrate for receiving underfill material into the gap. Underfill material

is dispensed into the gap through the one or more apertures, thereby filling the gap with

underfill material and providing a favorable flow rate and improved underfilling.

Embodiments of the invention are disclosed in which capillary action, a vacuum, or positive

pressure, are used to assist in the flow of the underfill material.

申请人：Charles Anthony Odegard,Marvin Wayne Cowens,Leon Stiborek

地址：McKinney TX US,Plano TX US,Dallas TX US

国籍：US,US,US

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