admin 管理员组

文章数量: 1086019


2024年12月27日发(作者：3d还原韩国梨泰院踩)

专利内容由知识产权出版社提供

专利名称：Electronic substrate device

发明人：Yoshitake Nishiuma,Koji Hashimoto

申请号：US12480292

申请日：20090608

公开号：US08014152B2

公开日：20110906

专利附图：

摘要：This invention is to provide an electronic substrate device which is capable of

reliably and stably transferring heat generated by a heat generating component to a

base member serving as a heat dissipater without intermediation of an electronic

substrate. An electronic substrate device according to the present invention, in which a

base member (A) includes a central protruding portion (A) which is accommodated in a

penetrating portion (A) while facing a die pad (A) through an intermediation of a first gap

(G), and first separated protruding portions (and ) which are provided around the central

protruding portion (A) and have a height dimension smaller than that of the central

protruding portion (A), the first separated protruding portions (and ) having a top surface

which abuts a rear surface portion of the electronic substrate (A) to form a second gap

(G), and in which a first heat transfer bond (A) which is a heat conductive adhesive is

applied to the first gap (G) and the second gap (G) communicating with the first gap (G).

申请人：Yoshitake Nishiuma,Koji Hashimoto

地址：Chiyoda-ku JP,Chiyoda-ku JP

国籍：JP,JP

代理机构：Sughrue Mion, PLLC

更多信息请下载全文后查看


本文标签： 专利 还原 知识产权 出版社

版权声明：本文标题：Electronic substrate device 内容由网友自发贡献，该文观点仅代表作者本人， 转载请联系作者并注明出处：http://www.roclinux.cn/p/1735322100a1647914.html， 本站仅提供信息存储空间服务，不拥有所有权，不承担相关法律责任。如发现本站有涉嫌抄袭侵权/违法违规的内容，一经查实，本站将立刻删除。