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2024年12月27日发(作者:yiia)

半导体行业英文术语

English:

Some common terms in the semiconductor industry include:

1. Integrated Circuit (IC): A small electronic device made out of a

semiconductor material that can perform an extensive range of

functions.

2. Semiconductor manufacturing: The process of creating integrated

circuits and semiconductor devices, including design, fabrication, and

packaging.

3. Wafer: A thin slice of semiconductor material used as the substrate

for the fabrication of integrated circuits.

4. Photolithography: A process used to transfer circuit patterns onto

the wafer surface using light and photoresist materials.

5. Die: A single piece of an integrated circuit, typically cut from a

wafer after fabrication and packaging.

6. Yield: The percentage of functional and operational semiconductor

devices produced during the manufacturing process.

7. Moore's Law: The observation that the number of transistors in a

dense integrated circuit doubles approximately every two years,

leading to exponential growth in processing power.

8. Quantum tunneling: A phenomenon in which electrons penetrate

through a potential barrier they classically shouldn't be able to cross,

crucial for the operation of semiconductor devices.

中文翻译:

半导体行业的一些常见术语包括:

1. 集成电路(IC):由半导体材料制成的小型电子器件,可执行广泛的功能。

2. 半导体制造:创建集成电路和半导体器件的过程,包括设计、制造和封装。

3. 晶圆:用作制造集成电路的基板的半导体材料薄片。

4. 光刻:使用光和光阻材料将电路图案转移到晶圆表面的过程。

5. 芯片:集成电路的单个组件,通常是在制造和封装后从晶圆上切割下来的。

6. 产量:在制造过程中生产的功能和运行的半导体器件的百分比。

7. 摩尔定律:密集集成电路中晶体管数量大约每两年翻倍一次的观察,导致

处理能力呈指数增长。

8. 量子隧穿:电子穿越传统上不能穿过的势垒的现象,对于半导体器件的操

作非常重要。


本文标签: 材料 制造 半导体 过程 半导体器件