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2024年12月27日发(作者：html网站源码大全)

专利内容由知识产权出版社提供

专利名称：Flexible-substrate-based three-dimensional

packaging structure and method

发明人：Xueping Guo,Yuan Lu

申请号：US15036090

申请日：20140612

公开号：US09997493B2

公开日：20180612

专利附图：

摘要：The present invention mainly relates to a 3-D packaging structure based on a

flexible substrate and a method for manufacturing the same; the method comprises:

providing a bendable continuous flexible substrate, determining the shape of the

substrate according to the size, the quantity and the shape of dies, and making surface

wiring on the substrate to allow interlayer electrical connection; welding dies that are to

be packaged onto the bendable continuous flexible substrate; filling the gaps between

the dies and the substrate with an underfill; bending the substrates towards the center

to allow the peripheral dies to coincide in parallel with the die situated at the center, and

bonding the two layers of parallel dies with a bonding adhesive. As compared with the

inventions available in the prior art, the present invention makes use of a flexible

substrate as a packaging substrate, which can better satisfy the demand for high density

and high levels of integration in packaging to achieve miniaturization of packaging, and

realizes die packaging of good compatibility and better performance.

申请人：Institute of Microelectronics, Chinese Academy of Sciences,NATIONAL

CENTER FOR ADVANCED PACKAGING (NCAP CHINA)

地址：Beijing CN,Jiangsu CN

国籍：CN,CN

代理机构：Pillsbury Winthrop Shaw Pittman LLP

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