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Global IC-Substrate （IC基板）Sales Market Report
2018
基板是一种用于集成电路的承载材料，具有用于连接芯片和PCB的内部电路。
包括刚性基板，柔性基板，材料的陶瓷基板和WB（引线键合），FC（倒装芯片）IC-
基板的封装方法。 IC-
Substrate主要用于PC（平板电脑，笔记本电脑），智能手机，可穿戴设备和其他
设备。而PC（平板电脑，笔记本电脑）的使用率最高，约占48％，其次是智能手机
（35.5％）。
2. 2016年全球生产了约12518平方米的IC-
Substrate，收入约为70.61亿美元。根据报告预测，2016年至2022年销售量的复
合年增长率（CAGR）将保持2.35％左右，2022年的全球销售额将达到14396平方米
，收入将达到65.59亿美元
3. 2012 - 2017年IC-
Substrate的全球平均价格呈下降趋势，从2012年的约817美元/平方米降至2016
年的564美元/平方米。价格将呈下降趋势，而有越来越多的参与者来。
4.台湾，韩国，日本和中国是过去几年全球四大IC-
Substrate销售市场，并将在未来几年保持同样的地位。日本目前是世界上最大的I
C-
Substrate客户。台湾是该报告中的第二大市场，2016年的消费份额约为24％，其
次是中国，占16％。其他主要市场是拥有领先技术的韩国，美国，欧洲等。
5. 目前，Ibiden，Shinko，Kyocera，Eastern，TTM
Technologies，Unimicron，Kinsus，Nanya，ASE，Semco，LG
Innotek，Simmtech，Daeduck，KCC（韩国电路公司），振鼎科技，AT＆S，深南电
路，ACCESS和深圳Fastprint Circuit Tech是全球IC-
Substrate市场的知名企业，2016年全球前十大市场占据了88％的市场份额.Ibiden
，Shinko，Kyocera是日本着名的IC-生产商目前的基材。
1. IC substrate is a type of carry material for integrated circuit with
internal circuit to connect the chips and PCBs. Including Rigid Substrate,
Flexible Substrate, Ceramic Substrates by Materials, and WB (wire
bonding), FC (flip chip) IC-Substrate by packaging method. The IC-
Substrate is mainly used for PC (Tablet, Laptop), Smart Phone, Wearable
Devices and Other Devices. And PC (Tablet, Laptop) is the largest usage
with the share of about 48%, followed by Smart Phone (35.5%).
2. In 2016, about 12518 K m² of IC-Substrate are produced worldwide,
generating the revenue of about $7061 million. The compound annual growth
rate (CAGR) of sales volume will maintain around 2.35 percent between
2016 and 2022 as predicted by the report, the global sales in 2022 will
reach 14396 K m² and $6559 million revenue.
3. The global average price of IC-Substrate is in the declining trend in
2012-2017, from about 817 $/m²in 2012 to 564 $/m² in 2016. And the price
will be in declining trend while there are more and more players come.
4. Taiwan, Korea, Japan and China are the four largest sales market of
IC-Substrate in the world in the past few years and it will keep the same
position in the next years. And Japan is the largest customer of IC-
Substrate in the world at present. Taiwan is the second largest market in
the report with a consumption share of about 24% in 2016, followed by
China with a share of 16%. Other key markets are Korea, USA, Europe, etc.
which have the leading technology.
5. Currently, Ibiden, Shinko, Kyocera, Eastern, TTM Technologies,
Unimicron, Kinsus, Nanya, ASE, Semco, LG Innotek, Simmtech, Daeduck, KCC
(Korea Circuit Company), Zhen Ding Technology, AT&S, Shennan Circuit,
ACCESS and Shenzhen Fastprint Circuit Tech are the well-known players in
the global IC-Substrate market, and the top 10 players took up about 88%
of the global market in 2016. Ibiden, Shinko, Kyocera are the Japanese
well-known producers of IC-Substrate at present.
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