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2024年12月27日发(作者：ignorence)

专利内容由知识产权出版社提供

专利名称：Flexible board assembly method and

assembly device

发明人：坂本 侑仁

申请号：JP2019093703

申请日：20190517

公开号：JP2020188232A

公开日：20201119

专利附图：

摘要：PROBLEM TO BE SOLVED: To stably perform an operation of inserting and

assembling a flexible substrate into an insertion port of a connector component.

SOLUTION: In the method of assembling a flexible substrate 6, the flexible substrate has

a hard portion that can be sucked and conveyed by a suction nozzle at least on the tip

side in the insertion direction with respect to the connector component 4, and the rear

portion of the hard portion. A flexible portion that can be flexed and deformed is

provided on the side, and the flexible substrate is lowered until the tip portion comes

into contact with the front side of the connector component on the plate surface of the

circuit board 2 in a state where the tip side is tilted downward. In a state where the tip

portion is in contact with the plate surface, the flexible substrate is slid and moved in the

insertion direction while the flexible portion is bent, and the tip portion is inserted into

the insertion port. [Selection diagram] Fig. 6

申请人：株式会社デンソー

地址：愛知県刈谷市昭和町１丁目１番地

国籍：JP

代理人：特許業務法人 サトー国際特許事務所

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