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2024年12月27日发(作者：影视cms开源)

专利内容由知识产权出版社提供

专利名称：METHOD OF SEGMENTING SUBSTRATE

WITH METAL FILM

发明人：Kenji MURAKAMI

申请号：US16758068

申请日：20181016

公开号：US2A1

公开日：20201203

专利附图：

摘要：A method that is capable of preferably segmenting a substrate with a metal

film. A method of segmenting a substrate with a metal film includes steps of: scribing a

predetermined segment position in a first main surface on which a metal film is provided

to form a scribe line and segmenting the metal film, and extending a vertical crack along

the predetermined segment position toward an inner side of the substrate; and making a

breaking bar have direct contact with the substrate with the metal film from a side of a

second main surface on which the metal film is not provided to further extend the vertical

crack, thereby segmenting the substrate with the metal film in the predetermined

segment position.

申请人：Mitsuboshi Diamond Industrial Co., Ltd.

地址：Settsu city, Osaka JP

国籍：JP

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