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2024年12月27日发(作者：指向tostring函数)

专利内容由知识产权出版社提供

专利名称：Substrate treatment method and substrate

treatment apparatus

发明人：Akira Miyata

申请号：US11518440

申请日：20060911

公开号：US07393566B2

公开日：20080701

专利附图：

摘要：The present invention is a substrate treatment method in which a treatment by

supplying a treatment solution from a nozzle to a substrate is successively performed

for a plurality of substrates, which comprises the step of, during the performance of the

successive treatments, performing between the treatments a plurality of pre-dispenses

for different purposes of the treatment solution, wherein at least a recipe of the

treatment solution to be pre-dispensed or a start condition of the pre-dispense is

determined for each of the pre-dispenses. According to the present invention, the pre-

dispense can be performed at a necessary and sufficient frequency to shorten the

suspension time due to the pre-dispenses in the substrate treatment. This improves the

throughput and reduces the number of pre-dispenses, resulting in reduced consumption

of the treatment solution.

申请人：Akira Miyata

地址：Kumamoto JP

国籍：JP

代理机构：Rader, Fishman & Grauer, PLLC

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