admin 管理员组

文章数量: 1086019


2024年12月27日发(作者：安卓app开发外包)

专利内容由知识产权出版社提供

专利名称：Substrate with a flattening film, display

substrate, and method of manufacturing the

substrates

发明人：Tohru Ueda

申请号：US10370461

申请日：20030224

公开号：US2A1

公开日：20031002

专利附图：

摘要：The invention involves: the forming of a dummy pattern for planarization

between convex portions (for example, between lead electrodes and a signal wire

pattern) of irregularities caused by a patterned layer on a surface on which at least one

interlayer insulating film is formed, so as to be separated by a predetermined distance

from the convex portions; the forming of interlayer insulating films -so as to fill up gaps

between the dummy pattern and the convex portions; and the planarizing of a surface.

Thereby, the invention is capable of relaxing requirements on uniformity in the thickness

of the film to be polished and the thickness of the polished portion.

申请人：UEDA TOHRU

更多信息请下载全文后查看


本文标签： 专利 知识产权 出版社 内容

版权声明：本文标题：Substrate with a flattening film, display substrat 内容由网友自发贡献，该文观点仅代表作者本人， 转载请联系作者并注明出处：http://www.roclinux.cn/p/1735375458a1655376.html， 本站仅提供信息存储空间服务，不拥有所有权，不承担相关法律责任。如发现本站有涉嫌抄袭侵权/违法违规的内容，一经查实，本站将立刻删除。