admin 管理员组

文章数量: 1086019


2024年12月27日发(作者：30 45 60 三角函数表)

专利内容由知识产权出版社提供

专利名称：SUBSTRATE PROCESSING METHOD AND

SUBSTRATE PROCESSING APPARATUS

发明人：SEKIGUCHI, Kenji,UCHIDA, Noritaka,TANAKA,

Satoru,OHNO, Hiroki

申请号：JP2006306534

申请日：20060329

公开号：WO06/137202P1

公开日：20061228

摘要：A substrate (W) is processed with a process liquid such as purified water. Then, a

first fluid which is more volatile than the process liquid is supplied onto the upper surface

of the substrate (W) from a fluid nozzle (12), thereby forming a liquid film on the upper

surface of the substrate (W). Following that, a second fluid which is more volatile than the

process liquid is supplied onto the upper surface of the substrate (W) from the fluid

nozzle (12) while rotating the substrate (W). At this time, the supply position (Sf) of the

second fluid relative to the substrate (W) is moved radially outwardly from the center of

rotation (Po). Consequently, there can be prevented formation of particles on the

substrate (W) after drying of the substrate using the first and second fluids.

申请人：SEKIGUCHI, Kenji,UCHIDA, Noritaka,TANAKA, Satoru,OHNO, Hiroki

地址：3-6, Akasaka 5-chome, Minato-ku, Tokyo 1078481 JP,c/o Tokyo Electron AT

Limited, 650, Mitsuzawa, Hosaka-cho, Nirasaki-shi, Yamanashi 4070192 JP,c/o Tokyo

Electron Kyushu Limited, 1-1, Fukuhara, Koshi-machi, Kikuchi-gun, Kumamoto 8611116

JP,c/o Tokyo Electron Kyushu Limited, 1-1, Fukuhara, Koshi-machi, Kikuchi-gun, Kumamoto

8611116 JP,c/o Tokyo Electron AT Limited, 650, Mitsuzawa, Hosaka-cho, Nirasaki-shi,

Yamanashi 4070192 JP

国籍：JP,JP,JP,JP,JP

代理机构：YOSHITAKE, Kenji

更多信息请下载全文后查看


本文标签： 专利 全文 下载 知识产权 出版社

版权声明：本文标题：SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESS 内容由网友自发贡献，该文观点仅代表作者本人， 转载请联系作者并注明出处：http://www.roclinux.cn/p/1735375760a1655420.html， 本站仅提供信息存储空间服务，不拥有所有权，不承担相关法律责任。如发现本站有涉嫌抄袭侵权/违法违规的内容，一经查实，本站将立刻删除。