多层陶瓷芯片电容器 NCC-016-1705说明书

MULTILAYER CERAMIC CHIP CAPACITORS

NCC-016-1705

1. Scope

This specification is applied to Multilayer Ceramic Chip Capacitor(MLCC) for use in electric equipment

for the voltage is ranging from 4V to 50V.

The series suitable for general electrics circuit, telecommunications, personal computers and peripheral,

power circuit and mobile application. (This product is compliant with the RoHS & HF.)

2. Parts Number Code

C 0603 X 104 K 050 T

(1) (2) (3) (4) (5) (6) (7)

(4)Capacitance

unit :pico farads(pF)

(1)Product

Code Nominal Capacitance (pF)

Product Code

C

104 100,000.0

Multilayer Ceramic Chip Capacitor

※

. If there is a decimal point, it shall be expressed by an

English capital letter R

(2)Chip Size

Code Length×Width unit : mm(inch)

(5)Capacitance Tolerance

0603 1.60× 0.80 (.063× .031)

Code Tolerance Nominal Capacitance

K ± 10.0 % More Than 10 pF

(3)Temperature Characteristics

Code Temperature Temperature Temperature

(6)Rated Voltage

Characteristic Range Coefficient

Code Rated Voltage (Vdc)

X7R -55

℃

~+125

℃

± 15%

X

50

050

(7)Tapping

Code Type

3. Nominal Capacitance and Tolerance

Class

Ⅱ

Characteristic

X7R

Tolerance

K (± 10.0 %)

T

Tape & Reel

3.1 Standard Combination of Nominal Capacitance and Tolerance

Nominal Capacitance

E-3, E-6 series

3.2 E series(standard Number)

Standard No.

E- 3

E- 6

E-12

E-24

1.0

1.0

1.0 1.2

1.0 1.2

1.1 1.3

1.5

1.5 1.8

1.5 1.8

1.6 2.0

Application Capacitance

2.2

2.2 3.3

2.2 2.7 3.3 3.9

2.2 2.7 3.3 3.9

2.4 3.0 3.6 4.3

4.7

4.7

4.7 5.6

4.7 5.6

5.1 6.2

6.8

6.8 8.2

6.8 8.2

7.5 9.1

4. Operation Temperature Range

Class

Ⅱ

Characteristic

X7R (X)

Temperature Range

-55

℃

~ +125

℃

Reference Temp.

25

℃

5. Storage Condition

Storage Temperature

：

5 to 40

℃

Relative Humidity

：

20 to 70 %

Storage Time

：

12 months max.

Page : 1 /15

MULTILAYER CERAMIC CHIP CAPACITORS

NCC-016-1705

6. Dimensions

6.1 Configuration and Dimension

：

BW

B

T

W

L

Unit:mm

TYPE

0603

L

1.60± 0.10

W

0.80± 0.10

T

0.85± 0.15

B (min)

0.40

BW (min)

0.15

6.2 Termination Type

：

Solder Metal

Barrier

Polymer Electrodes (If applicable)

External Electrodes

Inner Electrodes

Ceramic Body

Page : 2 /15

MULTILAYER CERAMIC CHIP CAPACITORS

NCC-016-1705

7. Performance

No.

1

2

3

Item

Visual

Dimension

Insulation

Resistance

Capacitance

Tanδ Class

Ⅱ

Specification

No abnormal exterior appearance

See Page 2

500/C Ω min.

Test Condition

Visual Inspection

Visual Inspection

Applied Voltage: Rated Voltage

Charge Time : 60±5 sec.

Charge-Discharge current shall be less than 50mA

current.

ClassⅡ：

Char Frequency Voltage

X7R 1KHz±10% 1.0±0.2Vrms

or 0.5±0.2Vrms

Perform a heat temperature at 150±5℃ for 30min

then place room temp. for 24±2hr.

* Depend on the individual parts.

6

7

Withstanding

Voltage

Temperature Class

Capacitance

Ⅱ

Coefficient

No dielectric breakdown or mechanical

breakdown

Char. Temp. Range Cap. Change(%)

X7R -55℃~+125℃ ± 15%

250% of the rated voltage for 1~5 sec.

charge/discharge Current is less than 50mA.

4

5

Within The Specified Tolerance

X7R: 10% max.

8 Adhesive Strength

Of Termination

9

Resistance Appear-

to ance

Flexure

of Substrate

C-Meter

ClassⅡ:

C2－C1 ×100%

C1

C1:Capacitance At Standard Temperature(25℃)

C2: Capacitance At Test Temperature (T2)

0.2Vrms min shall be applied.

No indication of peeling shall occur on the Pull force shall be applied for 10± 1 second.

terminal electrode.

≦0603----5N(≒ 0.5 Kg·f)

＞0603----10N(≒1.0 Kg·f)

N·f

No mechanical damage or capacitance

The board shall be bend 1.0mm with a rate of 1.0

change more than the following table.

mm/sec.

R230

Capacitance Change

Bending

Limit

Char. Cap. Change

≦ ± 12.5% of initial value

X7R (X)

C Meter

45±1mm

45±1mm

Page : 3 /15

MULTILAYER CERAMIC CHIP CAPACITORS

NCC-016-1705

No.

10

Item

Solderability

Specification Test Condition

More than 90% of the terminal surface is to be Solder Temperature : 245± 5℃

soldered newly, so metal part does not come out Dip Time : 5 ± 0.5sec

or dissolve. Immersing Speed : 25±10% mm/s

Solder : Lead Free Solder

Flux :Rosin

Preheat : At 80~120 ℃ for 10~30sec.

No mechanical damage shall occur.

ClassⅡ

X7R

X7R: 10% max.

≤ ±7.5% of initial value

ClassⅡ capacitor shall be set for 48±4 hours

at room temperature after one hour heat

treatment at 150 +0/-10℃ before initial

measure.

Preheat : at 150± 10℃ for 60~120sec.

Dip : solder temperature of 260± 5℃

Dip Time : 10 ± 1sec.

Immersing Speed : 25±10% mm/s

Flux :Rosin

Measure at room temperature after cooling for

ClassⅡ: 48 ± 4 Hours

ClassⅡ capacitor shall be set for 48±4 hours at

room temperature after one hour heat

treatment at 150 +0/-10℃ before initial

measure.

Capacitor shall be subjected to five cycles of

the temperature cycle as following:

Step

1

2

Temp.(℃)

Min Rated Temp. +0/-3

25

Time(min)

30

3

11 Resistance

To

Soldering

Heat

Appear-

ance

Capacit-

ance

Tanδ

ClassⅡ

Insulation

Resistance

To satisfy the specified initial value

12

Tempera-.

ture

Cycle

Appear-

ance

Capacit-

ance

Tanδ

ClassⅡ

Insulation

Resistance

No mechanical damage shall occur.

ClassⅡ

X7R

X7R: 10% max.

≤ ±7.5% of initial value

To satisfy the specified initial value

13 Humidity Appear-

ance

Capacit-

ance

No mechanical damage shall occur.

Characteristic

X7R

X7R: 20% max.

Cap. Change

≤ ±12.5% of initial value

Tanδ

ClassⅡ

Insulation

50/C Ω min.

Resistance

3 Max Rated Temp. +3/-0 30

4 25 3

Measure at room temperature after cooling for

ClassⅡ: 48 ± 4 Hours

ClassⅡ capacitor shall be set for 48± 4 hours

at room temperature after one hour heat

treatment at 150 +0/-10 ℃ before initial

measure.

Temperature : 40± 2℃

Relative Humidity : 90 ~ 95%RH

Test Time : 500 +12/-0Hr

Measure at room temperature after cooling for

ClassⅡ: 48 ± 4 Hours

Page : 4 /15

MULTILAYER CERAMIC CHIP CAPACITORS

NCC-016-1705

No.

14

Item

Humidity Appear-

Load ance

Capacit-

ance

Specification

No mechanical damage shall occur.

Test Condition

ClassⅡ capacitors applied DC voltage of the

rated voltage is applied for one hour at maximum

operation temperature ± 3℃then shall be set for

Characteristic Cap. Change

≤ ±12.5% of initial value

48± 4 hours at room temperature and the initial

X7R

measurement shall be conducted.

Applied Voltage :Rated Voltage

Tanδ X7R: 20% max.

Temperature : 40± 2℃

ClassⅡ

Relative Humidity : 90 ~ 95%RH

Insulation

25/C Ω min.

Test Time : 500 +12/-0Hr

Resistance

Current Applied : 50 mA Max.

Measure at room temperature after cooling for

ClassⅡ: 48 ± 4 Hours

15 High Appear- No mechanical damage shall occur. The capacitors applied DC testing voltage is

Temperature ance applied for one hour at maximum operation

Load

Capacit-

temperature ±3℃ then shell be set for 48± 4

Characteristic Cap. Change

≤ ±12.5% of initial value

hours at room temperature and the initial (Life Test)

ance

X7R

measurement shall be conducted.

Tanδ X7R: 20% max.

Applied Voltage: Rated Voltage

ClassⅡ

Temperature: max. operation temperature

Insulation

50/C Ω min.

Test Time : 1000 +48/-0 Hr

Resistance

Current Applied : 50mA Max

Measure at room temperature after cooling for

ClassⅡ: 48 ± 4 Hours

Solder the capacitor on P.C. board.

16 Vibration Appear- No mechanical damage shall occur

ance

Vibrate the capacitor with amplitude of

Capacit- Within the specified tolerance

1.5mm P-P changing the frequencies

ance

from 10Hz to 55Hz and back to 10Hz

Tanδ

To satisfy the specified initial value

in about 1 min.

ClassⅡ

Repeat this for 2 hours each in 3 perpendicular

Insulation To satisfy the specified initial value

directions.

Resistance

Page : 5 /15

MULTILAYER CERAMIC CHIP CAPACITORS

NCC-016-1705

When operating at temperature range from 100℃ to 125℃, the operation shall be carried

out at a derating voltage or less as shown below

Page : 6 /15

MULTILAYER CERAMIC CHIP CAPACITORS

NCC-016-1705

Fig.1

P.C. Board for Bending Strength Test

40mm

A

B

100mm

Solder Resist

Copper

C

Material : Glass Epoxy Substrate

: Copper (Thickness : 0.035mm)

: Solder Resist

Fig.2

Test Substrate

1.6mm

Solder Resist

Copper

C

Material : Glass Epoxy Substrate

40mm

A

B

: Copper (Thickness : 0.035mm)

: Solder Resist

Thickness : 1.6 mm

100mm

Type

0201

0402

0603

0805

1206

1210

1808

1812

2208

2211

2220

A

0.2

0.5

1.0

1.2

2.2

2.2

3.5

3.5

4.5

4.5

4.5

B

0.9

1.5

3.0

4.0

5.0

5.0

7.0

7.0

8.0

8.0

8.0

C

0.4

0.6

1.0

1.6

2.0

2.9

2.5

3.7

2.5

3.0

5.6

Unit:mm

Page : 7 /15

MULTILAYER CERAMIC CHIP CAPACITORS

NCC-016-1705

8. Packing

8.1 Bulk Packing

According to customer request.

8.2 Chip Capacitors Tape Packing

Empty Section

40mm min.

Chip Section

Empty Section

20mm min.

Drawing Direction

8.3 Material And Quantity

400mm min.

Tape

Material

Paper

Plastic

Tape

Material

Paper

Plastic

Tape

Material

Paper

Plastic

Tape 1812/2211/2220 1825/2225 2208

Material

T

≦

2.20mm T

＞

2.20mm T

≦

2.20mm T

＞

2.20mm T

≦

2.20mm

Paper NA NA NA NA NA

Plastic 1000 pcs/Reel 700 pcs/Reel 700 pcs/Reel 400 pcs/Reel 1000 pcs/Reel

NA

：

Not Available

T

≦

1.25mm

NA

3000 pcs/Reel

1808/1210

1.25mm

＜

T

≦

2.40mm

NA

2000 pcs/Reel

T

＞

2.40mm

NA

500/1,000 pcs/Reel

T

≦

1.00mm

4,000 pcs/Reel

NA

1206

1.00mm

＜

T

≦

1.25mm

NA

3,000 pcs/Reel

T

＞

1.25mm

NA

2,000 pcs/Reel

0201 0402 0603/0805

T

≦

0.33mm T

≦

0.55mm T

≦

1.00mm T

＞

1.00mm

15,000 pcs/Reel 10,000 pcs/Reel 4,000 pcs/Reel NA

NA NA NA 3,000 pcs/Reel

8.4 Cover Tape Reel Off Force

8.4.1 Peel-Off Force

5 g·f

≦

Peel-Off Force

≦

70 g·f

8.4.2 Measure Method

165 to 180°

Top Tape

Bottom Tape

Page : 8 /15

MULTILAYER CERAMIC CHIP CAPACITORS

NCC-016-1705

8.5 Paper Tape

Pitch Hold

A

B

I

Chip Inserting Hole

F

G

H

t

C

D

E

Unit:mm

E

2.00± 0.1

4.00± 0.1

TYPE

0201

0402

0603

0805

1206

1210

TYPE

0201

0402

0603

0805

1206

1210

A

0.37± 0.1

0.61± 0.1

1.10± 0.2

1.50± 0.2

1.90± 0.2

2.90± 0.2

F

1.75± 0.10

B

0.67± 0.1

1.20± 0.1

1.90± 0.2

2.30± 0.2

3.50± 0.2

3.60± 0.2

G

3.50± 0.05

C

4.00± 0.1

D

2.00± 0.05

H

8.0± 0.30

I

φ

1.50 +0.10/-0

t

1.10 max.

8.6 Plastic Tape

I

F

A

G

B

Pitch Hold

Chip Inserting Hole

H

t

J

Type

0805

1206

1210

1808

1812

1825

2208

2211

2220

2225

A

1.5±0.2

1.9±0.2

2.9±0.2

2.5±0.2

3.6±0.2

6.9

±

0.2

2.5±0.2

3.2±0.2

5.4±0.2

6.9

±

0.2

B

2.3±0.2

3.5±0.2

3.6±0.2

4.9±0.2

4.9±0.2

4.9

±

0.2

6.1±0.2

6.1±0.2

6.1±0.2

6.1

±

0.2

C

4.0± 0.1

D

2.0± 0.05

E

4.0± 0.1

O

C

D

E

Unit:mm

F

1.75± 0.1

8.0± 0.1

Page : 9 /15

MULTILAYER CERAMIC CHIP CAPACITORS

NCC-016-1705

Type

0805

1206

1210

1808

1812

1825

2208

2211

2220

2225

G

3.5± 0.05

H

8.0± 0.3

I

φ

1.5+0.1/-0

J

3.0 max.

t

0.3 max.

O

1.0± 0.1

5.5± 0.05 12.0 ± 0.3 4.0 max. 1.5± 0.1

8.7 Reel Dimensions

Reel Material

：

Polystyrene

A

D

E

C

B

W

Unit:mm

D

φ

21± 0.8

E

2.0±0.5

W

10± 0.15

Type

0201

0402

0603

0805

1206

1210

1808

1812

1825

2208

2211

2220

2225

A

φ

382 max

B

φ

50 min

C

φ

13± 0.5

φ

178

±

0.2

φ

60

±

0.2 13

±

0.3

Page : 10 /15

MULTILAYER CERAMIC CHIP CAPACITORS

NCC-016-1705

Precautionary Notes:

1. Storage

Store the capacitors where the temperature and relative humidity don’t exceed 40°C and 70%RH. We

recommend that the capacitors be used within 12 months from the date of manufacturing. Store the products in

the original package and do not open the outer wrapped, polyethylene bag, till just before usage. If it is open, seal

it as soon as possible or keep it in a desiccant with a desiccation agent.

2. Construction of Board Pattern

Improper circuit layout and pad/land size may cause excessive or not enough solder amount on the PC board. Not

enough solder may create weak joint, and excessive solder may increase the potential of mechanical or thermal

cracks on the ceramic capacitor. Therefore we recommend the land size to be as shown in the following table: 2.1

Size and recommend land dimensions for

reflow soldering

C

Capacitor Slit Land

EIA Code

0201

0402

0603

0805

1206

1210

1808

1812

1825

2208

2211

2220

2225

E

B

D

A

Solder Resistor

Chip (mm)

L

W

0.60 0.30

1.00 0.50

1.60 0.80

2.00 1.25

3.20 1.60

3.20 2.50

4.60 2.00

4.60 3.20

4.60 6.35

5.70 2.00

5.70 2.80

5.70 5.00

5.70 6.35

A

0.2~0.3

0.3~0.5

0.4~0.6

0.7~0.9

2.2~2.4

2.2~2.4

2.8~3.4

2.8~3.4

2.8~3.4

4.0~4.6

4.0~4.6

4.0~4.6

4.0~4.6

Land (mm)

B C D

0.2~0.4 0.2~0.4 --

0.3~0.5 0.4~0.6 --

0.6~0.7 0.6~0.8 --

0.6~0.8 0.8~1.1 --

0.8~0.9 1.0~1.4 1.0~2.0

1.0~1.2 1.8~2.3 1.0~2.0

1.8~2.0 1.5~1.8 1.0~2.8

1.8~2.0 2.3~3.0 1.0~2.8

1.8~2.0 5.1~5.8 1.0~4.0

2.0~2.2 1.5~1.8 1.0~4.0

2.0~2.2 2.0~2.6 1.0~4.0

2.0~2.2 3.5~4.8 1.0~4.0

2.0~2.2 5.1~5.8 1.0~4.0

E

--

--

--

--

3.2~3.7

4.1~4.6

3.6~4.1

4.8~5.3

7.1~8.3

3.6~4.1

4.4~4.9

6.6~7.1

7.1~8.3

2.2

Mechanical strength varies according to location of chip capacitors on the P.C. board.

Design layout of components on the PC board such a way to minimize the stress imposed on the

components, upon flexure of the boards in depanelization or other processes.

Component layout close to the edge of the board or the “depanelization line” is not recommended.

Susceptibility to stress is in the order of: a>b>c and d>e

e

perforation

c

slit

b

a

d

Page : 11 /15

MULTILAYER CERAMIC CHIP CAPACITORS

NCC-016-1705

2.3 Layout Recommendation

Example

Need to Avoid

Chip

Solder

Use of Common

Solder Land

Lead Wire

Solder With Chassis

Chassis

Excessive

Solder

Use of Common Solder

Land With Other SMD

Solder Land

Adhesive

PCB

Solder Land

Lead Wire

Chip

Solder Resist

α

Recommendation

Solder Resist

Adhesive

PCB

Solder Land

β

α>β

3. Mounting

3.1 Sometimes crack is caused by the impact load due to suction nozzle in pick and place operation.

In pick and place operation, if the low dead point is too low, excessive stress is applied to component. This may

cause cracks in the ceramic capacitor, therefore it is required to move low dead point of a suction nozzle to the

higher level to minimize the board warp age and stress on the components. Nozzle pressure is typically

adjusted to 1N to 3N (static load) during the pick and place operation.

Excessive Stress

Nozzle

Crack

Warping of Board

PCB

Warping of Board

3.2 Amount of Adhesive

b

a

Support pin

a

Example : 0805 & 1206

0.2mm min.

a

b

70 ~ 100 µm

c

Do not touch the solder land

c

c

Page : 12 /15

MULTILAYER CERAMIC CHIP CAPACITORS

NCC-016-1705

4. Soldering

4.1. Wave Soldering

Most of components are wave soldered with solder at 230 to 250°C. Adequate care must be taken to prevent

the potential of thermal cracks on the ceramic capacitors. Refer to the soldering methods below for optimum

soldering benefits.

Recommend flow soldering temperature Profile

Pre-heating

300

250

230

200

Soldering

Cooling

Soldering Method

1206 and Under

Change in Temp.(

℃

)

Δ

T ≤ 100~130 max.

T

e

m

p

e

r

a

t

u

r

e

(

°

C

)

Δ

T

60seconds or more

2 to 3 sec.

To optimize the result of soldering, proper preheating is essential:

1) Preheat temperature is too low

a. Flux flows to easily

b. Possibility of thermal cracks

2) Preheat temperature is too high

a. Flux deteriorates even when oxide film is removed

b. Causes warping of circuit board

c. Loss of reliability in chip and other components

Cooling Condition:

Natural cooling using air is recommended. If the chips are dipped into a solvent for cleaning, the temperature

difference (

Δ

T) between the solvent and the chips must be less than 100°C.

120seconds or more

4.2 Reflow Soldering

Preheat and gradual increase in temperature to the reflow temperature is recommended to decrease the

potential of thermal crack on the components. The recommended heating rate depends on the size of

component, however it should not exceed 3°C/Sec.

Recommend reflow profile for Lead-Free soldering temperature Profile (MIL-STD-202G #210F)

Soldering

Cooling

Pre-heating

260max.

217

Δ

T

260°C max./10sec.

Min.

※

The cycles of soldering : Twice (max.)

T

e

m

p

e

r

a

t

u

r

e

(

°

C

)

Soldering Method

1206 and Under

1210 and Over

Change in Temp.(

℃

)

Δ

T

≦

190

℃

Δ

T

≦

130

℃

150°C /60sec. Min.

70 to 90 sec.

Page : 13 /15

MULTILAYER CERAMIC CHIP CAPACITORS

NCC-016-1705

4.3 Hand Soldering

Sudden temperature change in components, results in a temperature gradient recommended in the following

table, and therefore may cause internal thermal cracks in the components. In general a hand soldering method

is not recommended unless proper preheating and handling practices have been taken. Care must also be

taken not to touch the ceramic body of the capacitor with the tip of solder Iron.

350

250

Soldering Method

1206 and Under

1210 and Over

Δ

T

Change in Temp.(

℃

)

Δ

T

≦

150

℃

Δ

T

≦

130

℃

T

e

m

p

e

r

a

t

u

r

e

(

°

C

)

200

Within 5 seconds.

How to Solder Repair by Solder Iron

1) Selection of the soldering iron tip

The required temperature of solder iron for any type of repair depends on the type of the tip, the substrate

material, and the solder land size.

2) recommended solder iron condition

a.) Preheating Condition

：

Board and components should be preheated sufficiently at 150°C or over,

and soldering should be conducted with soldering iron as boards and components are maintained

at sufficient temperatures.

b.) Soldering iron power shall not exceed 30 W.

c.) Soldering iron tip diameter shall not exceed 3mm.

d.) Temperature of iron tip shall not exceed 350°C to perform the process within 5 seconds.

(refer to MIL-STD-202G)

f.) Do not touch the ceramic body with the tip of solder iron. Direct contact of the soldering iron tip to ceramic

body may cause thermal cracks.

g.) After soldering operation, let the products cool down gradually in the room temperature.

5. Handling after chip mounted

5.1 Proper handling is recommended, since excessive bending and twist of the board, depends on the orientation

of the chip on the board, may induce mechanical stress and cause internal crack in the capacitor.

Higher potential of crack

Lower potential of crack

Bending

Twist

→

5.2 There is a potential of crack if board is warped due to excessive load by check pin

Support Pin

○

╳

Check pin

Page : 14 /15

Check pin

MULTILAYERAYER CERAMIC CHIP CAPACITORSORS

NCC-016-1705

5.3 Mechanical stress due to warping aing and torsion.

(a) Crack occurrence ratio will be in be increased by manual separation.

(b) Crack occurrence ratio will be in be increased by tensile force , rather than compressivressive force.

╳

:Tensile Stress s

○

:Compressive Stressess

6. Handling of Loose Chip Capacitortor

6.1 If dropped the chip capacitor may cmay crack.

Crack

Crack

Floor

PCPCB

6.2 In piling and stacking of the P.C. boards after mounting for storage or handling, the .C. bo, the corner of the P.C. board

may hit the chip capacitor mountedunted on another board to cause crack.

Crack

7. Safekeeping condition and period

For safekeeping of the products, we rewe recommend to keep the storage temperature betwebetween +5 to +40°C and

under humidity of 20 to 70% RH. The sThe shelf life of capacitors is 12 months.

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