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2024年12月27日发(作者：设置透明度css)
金属fcbga封装流程详解
I'm glad to explain the detailed process of metal fcbga packaging to
you. 我很高兴向您解释金属fcbga封装的详细过程。
First of all, the metal fcbga packaging process starts with the
fabrication of the substrate. Substrates are typically made of a
fiberglass-reinforced epoxy laminate, which provides a stable base
for the integrated circuit. 首先，金属fcbga封装的过程始于基板的制造。
基板通常由玻璃纤维增强环氧树脂层压板制成，为集成电路提供了稳定的基
础。
Once the substrate is prepared, the next step is to attach the
integrated circuit die to the substrate using wire bonding or flip chip
technology. Wire bonding involves using thin wires to connect the
die to the substrate, while flip chip technology uses solder bumps to
make the connection. 一旦基板准备好，下一步是使用线键合或倒装芯片
技术将集成电路芯片连接到基板上。线键合涉及使用细线将芯片与基板连接
起来，而倒装芯片技术则使用焊料凸点进行连接。
After the die is attached to the substrate, the assembly undergoes a
series of processes including mold encapsulation, ball attachment,
and reflow soldering. Mold encapsulation involves encapsulating the
die and wire bonds in a protective material to prevent damage and
contamination. ball attachment refers to the process of attaching
solder balls to the package for establishing electrical connections,
while reflow soldering involves heating the entire assembly to melt
the solder and create permanent connections. 芯片固定到基板后，装
配经历了一系列的工艺，包括模塑封装、焊球连接和回流焊。模塑封装涉及
将芯片和线键封装在一种防护材料中，以防止损坏和污染。焊球连接是指将
焊球连接到封装中以建立电连接，回流焊涉及加热整个组件以熔化焊料并建
立永久连接。
Following the encapsulation and ball attachment, the packaged
assembly undergoes a series of tests—such as electrical testing,
thermal cycling, and X-ray inspection—to ensure its conformance to
industry standards and quality requirements. 随着封装和焊球连接的完
成，封装组件经历了一系列测试，如电测试、热循环和X射线检测，以确保
其符合行业标准和质量要求。
Finally, the packaged assembly is marked with identification codes
and undergoes final inspection before being shipped to customers.
The identification codes facilitate traceability and help in quality
control, while final inspection ensures that the packaged
components meet all specified requirements. 最后，含有封装的组件被
标记了标识码，并在发货前经历了最终检验。标识码有助于追溯并帮助质量
控制，而最终检验确保封装组件满足所有指定要求。
Overall, the metal fcbga packaging process is a complex and intricate
set of procedures that require precision, attention to detail, and
adherence to strict quality standards. 总的来说，金属fcbga封装的过程
是一套复杂而精细的程序，需要精确、注重细节和严格遵守质量标准。
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