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2024年12月28日发(作者：structure thinking)

专利内容由知识产权出版社提供

专利名称：Substrate processing method and substrate

processing apparatus

发明人：Atsushi Shigeta,Gen Toyota,Hiroyuki

Yano,Kunio Oishi,Kenya Ito,Masayuki

Nakanishi,Kenji Yamaguchi

申请号：US11187024

申请日：20050722

公开号：US2A1

公开日：20060126

专利附图：

摘要：A substrate processing method is used to polish a substrate. The substrate

processing method includes rotating a substrate by a motor , polishing a first surface of a

peripheral portion of the substrate by pressing a polishing surface of a polishing

mechanism against the first surface, determining a polishing end point of the first surface

by monitoring a polished state of the first surface, stopping the polishing according to

the determining the polishing end point, determining a polishing time spent for the

polishing, determining a polishing time for a second surface of the peripheral portion

based on the polishing time of the first surface, and polishing the second surface for the

determined polishing time.

申请人：Atsushi Shigeta,Gen Toyota,Hiroyuki Yano,Kunio Oishi,Kenya Ito,Masayuki

Nakanishi,Kenji Yamaguchi

地址：Fujisawa-shi JP,Oita-shi JP,Yokohama-shi JP,Tokyo JP,Tokyo JP,Tokyo JP,Tokyo

JP

国籍：JP,JP,JP,JP,JP,JP,JP

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