admin 管理员组

文章数量: 1184232


2024年12月28日发(作者：如何在代码前面加两个零)

专利内容由知识产权出版社提供

专利名称：Substrate-based chip package

发明人：Martin Reiss,Alfred Haimerl,Steffen

Kroehnert

申请号：US10859459

申请日：20040602

公开号：US06949820B2

公开日：20050927

专利附图：

摘要：The invention relates to a substrate-based chip package, comprising a substrate

on which a chip is fastened by a die-attach material. The substrate is provided with a

solder resist (on both sides) and, on the side that is opposite from the chip, has

conductor tracks which are provided with solder balls and are connected to the chip by

means of wire bridges which extend through a bonding channel which is sealed with a

glob top. The chip and the substrate on the chip side being encapsulated by a molded

cap.

申请人：Martin Reiss,Alfred Haimerl,Steffen Kroehnert

地址：Medingen DE,Sinzing DE,Dresden DE

国籍：DE,DE,DE

代理机构：Slater & Matsil, L.L.P.

更多信息请下载全文后查看


本文标签： 专利 知识产权 出版社 内容

版权声明：本文标题：Substrate-based chip package 内容由网友自发贡献，该文观点仅代表作者本人， 转载请联系作者并注明出处：http://www.roclinux.cn/p/1735435058a1663785.html， 本站仅提供信息存储空间服务，不拥有所有权，不承担相关法律责任。如发现本站有涉嫌抄袭侵权/违法违规的内容，一经查实，本站将立刻删除。