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2024年12月28日发(作者：函数concatenate用法)

专利内容由知识产权出版社提供

专利名称：SUBSTRATE TREATMENT DEVICE AND

SUBSTRATE TREATMENT METHOD

发明人：WADA KATSUHITO,和田 雄人

申请号：JP2004225096

申请日：20040802

公开号：JP2006045593A

公开日：20060216

专利附图：

摘要：

PROBLEM TO BE SOLVED: To provide a substrate treatment device and a substrate

treatment method by which the occurrence of wrinkles in a substrate can be prevented

or suppressed at the time of substrate treatment, thereby reducing the nonuniformity of

the substrate treatment.

SOLUTION: In the substrate treatment device, a groove part having a prescribed wavy

shape is formed on the surface of a contact part with a flexible substrate in a heater

installed in each treatment chamber. In this way, the part to be thermally expanded in the

flexible substrate at the time of surface treatment is adsorbed. Thus, the occurrence of

wrinkles caused by thermal expansion in the flexible substrate and the nonuniformity of

the surface treatment accompanied thereby can be suppressed.

COPYRIGHT: (C)2006,JPO&NCIPI

申请人：FUJI ELECTRIC HOLDINGS CO LTD,富士電機ホールディングス株式会社

地址：神奈川県川崎市川崎区田辺新田１番１号

国籍：JP

代理人：服部 毅巖

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