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2024年12月28日发(作者：三个表连接查询)

专利内容由知识产权出版社提供

专利名称：SUBSTRATE MANUFACTURING METHOD,

AND SUBSTRATE CLEANING DEVICE

发明人：YAMADA TAKAYUKI,山田 剛之,HANAOKA

OSAMU,花岡 修

申请号：JP2012186337

申请日：20120827

公开号：JP2014042873A

公开日：20140313

专利附图：

摘要：PROBLEM TO BE SOLVED: To provide a substrate manufacturing method and a

substrate cleaning device, which can remove a foreign matter more reliably from the main

surface of a ON: A substrate manufacturing method comprises: a step

of preparing a substrate 10 having one pair of facing main surfaces 12a and 12b, and two

sets of facing end faces 14a to 14d; a first washing step of washing the lower main

surface 12b by supporting the substrate 10 by clamping one paired facing end faces 14a

and 14b by a first support 20 and by moving a first cleaning brush 40 relative to the

lower main surface 12b in the direction between the paired facing end faces 14a and 14b;

and a second washing step of washing the lower main surface 12b by supporting the

substrate 10 by clamping the paired facing end faces 14a and 14b by a second support

30, and by moving a second cleaning brush 50 relative to the lower main surface 12b in a

direction between the paired facing end faces 14a and 14b.

申请人：HOYA CORP,ＨＯＹＡ株式会社

地址：東京都新宿区中落合２丁目７番５号

国籍：JP

代理人：特許業務法人 津国,津国 肇,柳橋 泰雄,伊藤 佐保子,生川 芳徳,石岡 隆

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