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2024年12月28日发(作者：vue 滚动条)
专利内容由知识产权出版社提供
专利名称：Substrate treatment apparatus, substrate
treatment method and substrate
manufacturing method
发明人：Yoshihiro Moriguchi,Ryo Izaki,Yoshitomo
Yasuike,Takao Kamaishi,Takahisa Ishida
申请号：US10813926
申请日：20040331
公开号：US2A1
公开日：20050203
专利附图：
摘要：Above a substrate mounted on rollers, an upper board is prepared a
predetermined distance apart from the substrate. A pipe fills a space between the upper
board and the substrate with washing water by supplying the washing water at a
predetermined flow rate. A washing water layer is formed evenly on an upper surface of
the substrate when the substrate passes below the upper board. Below the substrate, a
lower board is prepared a predetermined distance apart from the substrate. A pipe fills a
space between the lower board and the substrate with the washing water by supplying
the washing water at a predetermined flow rate. A washing water layer is formed evenly
on a lower surface of the substrate when the substrate passes above the lower board.
The air emitted from an air knife is sprayed to the upper/lower surface of the substrate
slantingly at a predetermined incident angle in an opposite direction of a substrate
moving direction. The washing water is pushed away and removed from the upper/lower
surface of the substrate.
申请人：Yoshihiro Moriguchi,Ryo Izaki,Yoshitomo Yasuike,Takao Kamaishi,Takahisa
Ishida
地址：Hiratsuka-shi JP,Kanagawa-ken JP,Kanagawa-ken JP,Hadano-shi JP,Hadano-shi
JP
国籍：JP,JP,JP,JP,JP
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