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2024年12月28日发(作者：asp是前端还是后端)

专利内容由知识产权出版社提供

专利名称：Substrate processing apparatus and

substrate inspection method

发明人：Shiga, Masayoshi c/o Dainippon Screen

., Ltd,Hashinoki Kenji c/o Dainippon

Screen ., Ltd,Ohtani, Masami c/o

Dainippon Screen ., Ltd,Nishimura,

Joichi c/o Dainippon Screen .,Ltd

申请号：EP01121029.1

申请日：20010831

公开号：EP1184895A3

公开日：20060125

专利附图：

摘要：An inspection unit is provided in a substrate processing apparatus performing

resist coating processing and development processing on a substrate. In the inspection

unit, a film thickness measuring device, a line width measuring device, an overlay

measuring device and a macro defect inspection device are successively stacked and

arranged from below. The inspection unit is provided on an intermediate portion of a

substrate transport path formed in the substrate processing apparatus. The substrate

processed in the substrate processing apparatus is selectively introduced into each

inspection part. Therefore, the apparatus can properly inspect the substrate at need

while suppressing reduction of the throughput. Thus provided are a substrate processing

apparatus and a substrate inspection method capable of properly inspecting a substrate

while suppressing reduction of the throughput.

申请人：Dainippon Screen Mfg. Co., Ltd.

地址：1-1, Tenjinkitamachi, Teranouchi-agaru 4-chome, Horikawa-dori, Kamikyo-ku

Kyoto 602-8585 JP

国籍：JP

代理机构：Goddar, Heinz J.

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