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2024年12月28日发(作者：嵌入式软件是什么意思)

专利内容由知识产权出版社提供

专利名称：THIN-FILM WIRING SUBSTRATE AND

SUBSTRATE FOR PROBE CARD

发明人：HASHIMOTO,Toshihiro,橋本利弘

申请号：JP2012/071816

申请日：20120829

公开号：WO2013/031822A1

公开日：20130307

专利附图：

摘要：A thin-film wiring substrate has a base (B) that includes a ceramic substrate (1)

having a top surface and a wiring conductor (11) provided on the top surface of the

ceramic substrate, a bonding layer (2) and a thin-film wiring layer (3) successively

laminated on the top surface of the ceramic substrate (1), and a through-hole conductor

(23) that electrically connects the wiring conductor (11) and the thin-film wiring layer (3)

piercing the bonding layer (2) in the thickness direction. The bonding layer (2) is a thin-

film wiring substrate composed of a core layer (21) composed of a heat-hardened resin

and adhesive layers (22) that are composed of a heat-hardened resin having a smaller

coefficient of elasticity than the heat-hardened resin forming the core layer (21) and are

laminated on the upper and lower surfaces of the core layer (21). Deformation of the

bonding layer (2) can be suppressed by the core layer (21). Good electrical connections of

a through conductor (23) and a thin-film conductor layer (31) with the wiring conductor

(11) can be ensured. In addition, the adhesiveness of the bonding layer (2) can be ensured

by the adhesive layer (22).

申请人：KYOCERA CORPORATION,京セラ株式会社,HASHIMOTO,Toshihiro,橋本　利弘

地址：〒6128501 JP,〒6128501 JP,〒6128501 JP,〒6128501 JP

国籍：JP,JP,JP,JP

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本文标签： 专利 嵌入式软件 知识产权 出版社 内容

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