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2024年12月28日发(作者：css是什么文件夹可以删除吗)

专利内容由知识产权出版社提供

专利名称：Substrate-embedded capacitor, production

method thereof, and circuit board

发明人：Mitsutoshi Higashi,Hideaki Sakaguchi,Hiroko

Koike

申请号：US10453311

申请日：20030603

公开号：US2A1

公开日：20031204

专利附图：

摘要：There is provided a capacitor embedded in a substrate having a small thickness

and requiring only a small space for short connection lines. The substrate-embedded

capacitor comprises a substrate having an opening, a first conductive layer on the

substrate, a dielectric layer on the first conductive layer, a second conductive layer on the

dielectric layer, and an insulating layer formed on the second conductive layer and having

an opening. In the substrate-embedded capacitor, the first conductive layer and the

second conductive layer are exposed through the openings in the substrate and the

insulating layer, respectively.

申请人：HIGASHI MITSUTOSHI,SAKAGUCHI HIDEAKI,KOIKE HIROKO

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