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2024年12月28日发(作者：css下划线代码)

专利内容由知识产权出版社提供

专利名称：SUBSTRATE TREATING APPARATUS,

SUBSTRATE TREATING METHOD, AND

METHOD FOR MANUFACTURING HIGH-

VOLTAGE DEVICE

发明人：Satoshi Koide,Yasushi Iseki,Akira Ishii

申请号：US12343642

申请日：20081224

公开号：US2A1

公开日：20090625

专利附图：

摘要：A substrate treating apparatus, in which a voltage is applied to between a

treatment electrode and a target substrate in such a state that the treatment electrode

is opposed to the target substrate to thereby perform substrate treatment for

removing undesired substances on the target substrate, has a reference electrode, a

transfer unit which transfers at least one of the treatment electrode and the reference

electrode to thereby provide the treatment electrode so that the treatment electrode is

opposed to the reference electrode, and a check unit for applying a voltage to between

the treatment electrode and the reference electrode in such a state that the treatment

electrode is opposed to the reference electrode and thereby checking an adhesion level

of undesired substances onto the treatment electrode surface.

申请人：Satoshi Koide,Yasushi Iseki,Akira Ishii

地址：Fukaya-shi JP,Yokohama-shi JP,Machida-shi JP

国籍：JP,JP,JP

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