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2024年12月28日发(作者：美国众议院议长佩洛西)

专利内容由知识产权出版社提供

专利名称：Substrate for, as well as its method of

manufacturing a substrate with a temporary

support member removal

发明人：オリビエ、ライサック,ファブリス、ルテルトル

申请号：JP2004502345

申请日：20030430

公开号：JP2005524241A

公开日：20050811

专利附图：

摘要： Method for manufacturing a substrate with the following steps: temporary

support member (10) on, causing (12) a fragile bonding states near the interface between

the temporary support member and the first layer, the first The form (20) at least a

portion of the layer region is partially etched and selectively the first layer a (20, 30),

etched in the level of binding vulnerable above the substrate at least substantially so as

to form a (C) a cavity which is closed more substantially, and the formed (10) on the

temporary support member (40) a second layer covering the etched regions or one on

the entire surface allowed to bind the first layer to the (20, 30) on, exposing the entire

structure of the above results in forcing to separate the layers of the first and (20, 30)

from (10) temporary support member in an above fragile bond . Application to a

substrate to make a device in optical engineering microelectronics or optoelectronics.

申请人：エス．オー．アイ．テック、シリコン、オン、インシュレター、テクノロジーズ

地址：フランス国ベルナン、パルク、テクノロジーク、デ、フォンテーヌ、シュマン、デ、フ

ランク

国籍：FR

代理人：吉武 賢次,橘谷 英俊,佐藤 泰和,吉元 弘,川崎 康

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