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2024年12月28日发(作者：laravel都在用哪个版本)

专利内容由知识产权出版社提供

专利名称：Lead frame and substrate semiconductor

package

发明人：Mariano Layson Ching, Jr.,Allen M.

Descartin,Bo Li

申请号：US14142924

申请日：20131230

公开号：US09190353B2

公开日：20151117

专利附图：

摘要：A semiconductor chip package includes a lead frame having a die paddle, leads

surrounding the paddle and a central window through the paddle. A substrate has a base

side and a superior side. A peripheral portion of the base side is secured to the paddle

and a central portion of the base side is exposed through the central window. A

semiconductor chip is secured to the superior side of the substrate. The semiconductor

chip is electrically connected to the plurality of leads and the substrate. A mold

compound covers at least portions of the lead frame, the substrate and the

semiconductor chip. The chip package can be electrically connected to other devices or a

circuit board by way of the leads and BGA pads of the substrate exposed in the central

window.

申请人：Mariano Layson Ching, Jr.,Allen M. Descartin,Bo Li

地址：Tianjin CN,Lapulapu PL,Tianjin CN

国籍：CN,PL,CN

代理人：Charles Bergere

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