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2024年12月28日发(作者：sqlserver2008manager studio)

英文回答：

The manufacturing process of lead frame utilizing the chemical

etching methodprises a series of sequential steps. Firstly, the

substrate material, typicallyposed of copper or copper alloy,

undergoes a meticulous cleaning process to eliminate any

impurities before being coated with a layer of photoresist.

Subsequently, the photoresist layer is exposed to a precisely

defined pattern of light that corresponds to the intended lead

frame design. Through this photolithography process, the

pattern is meticulously transferred to the photoresist, following

which the unexposed areas are dissolved away, thereby

delineating the desired pattern on the substrate. This crucial

photolithography step is imperative for accurately defining the

lead frame pattern.

利用化学蚀刻方法制造铅架的过程使一系列步骤相继出现。 一般由铜

或铜合金制成的底质材料经过细致的清洗过程，以消除任何杂质，然

后涂上一层光阻剂。 随后，光阻层暴露在精确定义的光线图案上，与

预期的铅框设计相对应。 通过这种照相平版印刷过程，该图案被细心

地转移到光阻器上，之后未暴露区域被溶解，从而在底物上划定了所

期望的图案。 这一关键的照相平版印刷步骤对于准确界定铅框架模式

至关重要。

So, the next thing we do is use a special chemical to get rid of

the extra copper on the material and show the pattern of the

lead frame. We usually use an acid solution that dissolves the

exposed copper but leaves the protected areas. It's really

important to control this process carefully so that the lead

frame ends up with the right size and shape. Once the copper is

all gone, we take off the rest of the protective coating and clean

up the lead frames to check for any problems.

我们接下来要做的是使用一种特殊的化学物质去除材料上的额外的铜，

并显示铅框的图案。 我们通常使用一种酸溶液溶解暴露的铜但离开保

护区。 要小心地控制这个过程，使铅架最终具有合适的大小和形状，

这是非常重要的。 一旦青铜器全部消失，我们就脱掉其余的防护涂层，

清理铅架，以检查是否有问题。

In the concluding phase of the manufacturing process, it is

customary to apply a thin layer of solder or alternative surface

finish to the lead frames in order to enhance their solderability

and resistance to corrosion. These treated lead frames stand

prepared for utilization in a variety of electronic packaging

applications, including but not limited to semiconductor devices

and integrated circuits. The utilization of the chemical etching

method offers numerous advantages in the production of lead

frames, most notably the attainment of high precision, fine

feature resolution, and the capacity to fabricateplex geometries

at a minimal tooling cost.

在制造过程的最后阶段，通常将一层薄薄的焊接机或替代的表面完成

到铅架上，以提高其可燃性和抗腐蚀性。 这些经过处理的铅架架准备

用于各种电子包装应用，包括但不限于半导体装置和集成电路。 化学

蚀刻方法的利用在铅架的生产方面提供了许多优势，最显著的是达到

高精度、精细的特性分辨率，以及能够以最低的工具成本制造精密的

几何元件。


本文标签： 铅架 过程 图案 暴露 制造

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