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专利名称:Integrated thermostat overmolded leadwire

construction

发明人:Colin Drummond,Vipin J. Pillai

申请号:US11590064

申请日:20061031

公开号:US2A1

公开日:20080626

专利附图:

摘要:A system and method for the integration of lead frame technology within an

electro-mechanical switching device. An integrated thermostat system can be formed,

which includes a lead frame substrate, at least one electro-mechanical lead frame

configured upon said lead frame substrate, and an electro-mechanical switching device

associated with the electro-mechanical lead frame, wherein the electro-mechanical lead

frame is integrated with said electro-mechanical switching device within said electro-

mechanical switching device. A thermal response component is generally associated with

said electro-mechanical switching device

申请人:Colin Drummond,Vipin J. Pillai

地址:Glasgow GB,Bellshill GB

国籍:GB,GB

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