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2024年12月28日发(作者：not null default)

专利内容由知识产权出版社提供

专利名称：Ultra-thick thick film on ceramic substrate

发明人：Lynda G. Flederbach,Rick A. Weed,Bradley H.

Carter,Erich W. Gerbsch,John K. Isenberg,Carl

W. Berlin

申请号：US11823690

申请日：20070628

公开号：US2A1

公开日：20090101

专利附图：

摘要：An electrically isolated and thermally conductive double-sided pre-packaged

integrated circuit component exhibiting excellent heat dissipative properties, durability

and strength, and which can be manufactured at a low cost includes electrically insulated

and thermally conductive substrate members having outer surfaces, ultra-thick thick film

materials secured to the outer surfaces of the substrate members and a lead member

and a transistor member positioned between the substrate members.

申请人：Lynda G. Flederbach,Rick A. Weed,Bradley H. Carter,Erich W. Gerbsch,John K.

Isenberg,Carl W. Berlin

地址：Kokomo IN US,Kokomo IN US,Kokomo IN US,Cicero IN US,Rossville IN US,West

Lafayette IN US

国籍：US,US,US,US,US,US

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