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2024年12月29日发(作者：网页设计静态和动态有什么区别)

专利内容由知识产权出版社提供

专利名称：SEMICONDUCTOR SUBSTRATE ASSEMBLY

发明人：Peng-Shu CHEN,Shih-Hsien WU

申请号：US14570684

申请日：20141215

公开号：US2A1

公开日：20150409

专利附图：

摘要：A semiconductor substrate assembly includes a semiconductor material layer, a

first isolation layer, a second isolation layer, a first conductive pillar, and a second

conductive pillar. The semiconductor material layer has a first surface and a second

surface opposite to the first surface. The first isolation layer is located on the first

surface of the semiconductor material layer. The second isolation layer is located on the

second surface of the semiconductor material layer. The first conductive pillar, supplied

with a first voltage, penetrates the semiconductor material layer, the first isolation layer,

and the second isolation layer. The second conductive pillar is supplied with to a second

voltage, and a part of the second conductive pillar is formed in the second isolation layer,

the second conductive pillar penetrates the second isolation layer and touches the

second surface of the semiconductor material layer.

申请人：INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

地址：Hsinchu TW

国籍：TW

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