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2024年12月29日发(作者：high回去wwqqqz)

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专利名称：MANUFACTURE OF LAMINATED SUBSTRATE

FOR MOUNTING INTEGRATED CIRCUIT

发明人：TAKAHARA MASAYOSHI

申请号：JP11742487

申请日：19870513

公开号：JPS63281449A

公开日：19881117

摘要：PURPOSE:To inhibit the retention of chemicals used by a chip mounting process

by fixing a second substrate, to which a hole section or a recessed section is formed, to a

section coating the electrical connecting section of a chip fastened onto a first substrate,

to which a pattern is shaped, and the pattern and bringing a printed substrate to a

multilayer state. CONSTITUTION:An integrated circuit mounting section 2 and circuit

patterns 3 are shaped onto a substrate 1 as a base substrate, and the mounting section 2

is plated with a metal (Au, etc.). The whole is washed for removing an impurity such as

remaining and adhering alkali metallic ions, halogen ions, etc., and the substrate is baked

and an integrated circuit (a chip) 4 is mounted to the mounting section 2 by using paste

such as an Au-Si eutectic, and bonded by wires 6. The integrated circuit mounting section

and wire bonding sections are coated (bonding may be used) by employing a synthetic

resin 7, and baked for curing the resin. The printed substrate 1 in which the circuit

patterns are shaped and the integrated circuit is mounted completely is used as the base

substrate, and other printed substrates are laminated onto the substrate 1 by employing

adhesives such as the resin, thus forming a laminated substrate.

申请人：CLARION CO LTD

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