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2024年12月29日发(作者：c语言中input和output的用法)
专利内容由知识产权出版社提供
专利名称：SUBSTRATE DIVIDING SYSTEM, SUBSTRATE
MANUFACTURING EQUIPMENT, SUBSTRATE
SCRIBING METHOD AND SUBSTRATE
DIVIDING METHOD
发明人：NISHIO, Yoshitaka, MITSUBOSHI DIAMOND
IND. CO.,LTD,OKAJIMA, Yasutomo,
MITSUBOSHI DIAMOND IND.
CO.,LTD,OSHIMA, Yukio, MITSUBOSHI
DIAMOND IND. CO. LTD.,OHNARI, Hiroyuki,
MITSUBOSHI DIAMOND IND. CO.,
LTD,YOSHIMOTO, K., MITSUBOSHI
DIAMOND IND CO., LTD.
申请号：EP05720746.6
申请日：20050314
公开号：EP1741527A1
公开日：20070110
专利附图：
摘要：The objective of the present invention is to provide a substrate cutting system
which requires a small footprint area so as to be compact, and also which is capable of
efficiently cutting a substrate. Clamp devices 50 are attached to the substrate cutting
system. The clamp devices can hold at least one part of a side edge of the mother
substrate to be carried-in a mounting base 10 in a hollow rectangular parallelepiped and
reciprocate along one side of the mounting base 10 in a hollow rectangular
parallelepiped. A pair of substrate cutting devices are provided in a cutting device guide
body 30 so as to be movable along a direction perpendicular to the moving direction of
the clamp devices 50, the pair of substrate cutting devices cutting the mother substrate
from each of the top surface and the bottom surface of the mother substrate which is
clamped by the clamp devices 50. When the clamp devices 50 holding the mother
substrate are moved, a substrate supporting device supports the mother substrate
without rubbing against the mother substrate.
申请人：Mitsuboshi Diamond Industrial Co., Ltd.
地址：2-12-12 Minami-Kaneden Suita-city, Osaka 564-0044 JP
国籍：JP
代理机构：TBK-Patent
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