admin 管理员组

文章数量: 1184232


2024年12月29日发(作者：sqlserver怎么读音是什么)

专利内容由知识产权出版社提供

专利名称：SEMICONDUCTOR COMPONENT WITH AT

LEAST ONE SEMICONDUCTOR CHIP ON A

BASE CHIP SERVING AS SUBSTRATE AND

METHOD FOR PRODUCTION THEREOF

发明人：HUEBNER, Holger

申请号：DE2002001783

申请日：20020517

公开号：WO02/095817P1

公开日：20021128

摘要：According to the invention, a semiconductor component, with at least one

semiconductor chip (20) on a base chip (10) serving as substrate has contact surfaces (11,

21) made of metal on the at least one semiconductor chip (20) and the base chip (10). The

semiconductor chip (20) and the base chip (10) are thus arranged relative to each other

such that the corresponding contact surfaces of the at least one semiconductor chip (20)

and the base chip (10) are facing each other and the facing contact surfaces (11, 21) are

electrically connected to each other. The separation between a contact surface of the at

least one semiconductor chip (20) and the corresponding contact surface of the base chip

(10) is less than 10 µm. The base chip (10) comprises components produced by a first

technique, whilst the at least one semiconductor chip (20) comprises components

produced by means of a second technique.

申请人：HUEBNER, Holger

地址：DE,DE

国籍：DE,DE

代理机构：EPPING, HERMANN & FISCHER

更多信息请下载全文后查看


本文标签： 专利 全文 下载 知识产权 出版社

版权声明：本文标题：SEMICONDUCTOR COMPONENT WITH AT LEAST ONE SEMICON 内容由网友自发贡献，该文观点仅代表作者本人， 转载请联系作者并注明出处：http://www.roclinux.cn/p/1735508969a1673755.html， 本站仅提供信息存储空间服务，不拥有所有权，不承担相关法律责任。如发现本站有涉嫌抄袭侵权/违法违规的内容，一经查实，本站将立刻删除。