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2024年12月27日发(作者：乱世佳人电影在线免费)

专利内容由知识产权出版社提供

专利名称：Substrate treatment apparatus and

substrate treatment method

发明人：Terada, Shouichi Tokyo Electron Kyushu

Limited,Mizuno, Tsuyoshi Tokyo Electron

Kyushu Limited,Uehara, Takeshi Tokyo

Electron Kyushu Limited

申请号：EP06024119.7

申请日：20061121

公开号：EP1791160A2

公开日：20070530

专利附图：

摘要：In a substrate treatment method for supplying a coating solution to a substrate

with projections and depressions on a front surface thereof to form a coating film on the

front surface of the substrate, the coating solution is supplied to the rotating substrate

to form a coating film on the front surface of the substrate, and the substrate having the

coating film formed thereon is heated to adjust an etching condition of the coating film.

Next, the etching solution is supplied to the rotating substrate to etch the coating film,

and thereafter the coating solution is supplied to the substrate to form a flat coating

film on the front surface of the substrate. Thereafter, the substrate is heated to cure the

coating film. This flattens the coating film with uniformity and high accuracy without

undergoing a high-load process such as chemical mechanical polishing.

申请人：Tokyo Electron Ltd.

地址：3-6 Akasaka 5-chome MInato-ku Tokyo-to JP

国籍：JP

代理机构：HOFFMANN EITLE

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