FPGA可编程逻辑器件芯片XC7A200T-1FBG676I中文规格书

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FPGA，上赛灵思半导体（深圳）有限公司

Overview

To ensure business continuity and enable high volume supply chain capabilities for all Virtex®-6 and selected

7 series FPGAs product families, Xilinx is qualifying an additional substrate supplier, Unimicron Technology

Corporation (UMTC) for flip chip ball grid area (FCBGA) packages.

For Virtex-6 FPGAs, this change affects all standard and specification control document (SCD) XC Commercial (C)

and Industrial (I) grade devices. Hi-Rel “XQ” devices are not affected by this PCN.

For Artix®-7, Zynq®-7000 All Programmable, Virtex®-7 and Kintex®-7 in the SB, FB, FF, SBG, FBG and FFG

packages, this change affects all standard and specification control document (SCD) XC Commercial (C) grade,

Extended (E) grade and Industrial (I) grade devices. Virtex-7 in the FL, FLG, FH and FHG packages, and Automotive

“XA” devices for 7 series FPGAs are not affected by this PCN. Kintex®-7Q, Virtex®-7Q and Zynq®-7000Q All

Programmable Hi-Rel “XQ” FPGAs RF flip chip packages are affected (Refer to XCN14013).

This additional supplier will adhere to the same performance, quality and reliability specifications that apply to all

product families proven through extensive qualification and testing. As a result, there is no change in form, fit,

function, or reliability with this substrate supplier addition.

FAQs

Q: What is the change?

Xilinx is qualifying an additional substrate supplier, Unimicron Technology Corporation (UMTC) for flip chip ball grid

area (FCBGA) packages for all Virtex-6 and selected 7 series FPGAs product families. UMTC is a reputable

company supplying component substrate and system printed circuit board to many semiconductor customers and

original equipment make (OEM) customers for over 10 years.

Q: Why is Xilinx making this change?

This change ensures business continuity and enables high volume supply chain capabilities for Xilinx product

families.

Q: Why adding Phase 3?

As a result of the successful implementation for Xilinx FPGAs (Virtex-6 FPGAs and 7-series), we are expanding

this program to include SoC (Zynq-7000 All Programmable) to this change.

Q: Which products are affected?

For Virtex-6 FPGAs, this change affects all standard and specification control document (SCD) XC Commercial (C)

and Industrial (I) grade devices. Hi-Rel “XQ” devices in the FFG1156 package are not affected by this PCN.

For Artix-7, Zynq-7000 All Programmable, Virtex-7 and Kintex-7 in the SB, FB, FF, SBG, FBG and FFG packages,

this change affects all standard and specification control document (SCD) XC Commercial (C) grade, Extended (E)

grade and Industrial (I) grade devices. Virtex-7 in the FL, FLG, FH and FHG packages, and Automotive “XA” devices

XTP385 (v2.0) March 30, 2015

FAQ: Transition Schedule for Substrate Supplier for Virtex-6 and 7 Series FPGAs Flip Chip Packages

for 7 series FPGAs are not affected by this PCN. Kintex-7Q, Virtex-7Q and Zynq-7000Q All Programmable Hi-Rel

“XQ” FPGAs RF flip chip packages are affected (Refer to XCN14013).

Affected device package-pin are listed in the Table 1, Table 2, Table 3, Table 4 and Table 5 below:

Table 1: Virtex-6 FPGAs Devices Package Product Affected

Device Package-Pin Device Package-Pin

XC6VCX130T

XC6VCX195T

XC6VCX240T

XC6VCX75T

XC6VHX250T

XC6VHX255T

FF(G)784

(1)

FF(G)1156

(1)

FF(G)784

(1)

FF(G)1156

(1)

FF(G)784

(1)

FF(G)1156

(1)

FF(G)784

(1)

FF(G)1154

(1)

FF(G)1155

(1)

FF(G)1923

(1)

FF(G)1154

(1)

XC6VHX380T

FF(G)1155

(1)

FF(G)1923

(1)

FF(G)1924

(1)

XC6VLX365T

XC6VLX550T

XC6VLX75T

XC6VLX240T

XC6VHX565T

XC6VLX130T

XC6VLX195T

FF(G)1923

(1)

FF(G)1924

(1)

FF(G)784

(1)

FF(G)1156

(1)

FF(G)784

(1)

FF(G)1156

(1)

FF(G)784

(1)

FF(G)1156

(1)

FF(G)1759

(1)

FF(G)1156

(1)

FF(G)1759

(1)

FF(G)1759

(1)

FF(G)1760

(1)

FF(G)784

(1)

Device

XC6VLX760

XC6VSX315T

XC6VSX475T

Package-Pin

FF(G)1760

(1)

FF(G)1156

(1)

FF(G)1759

(1)

FF(G)1156

(1)

FF(G)1759

(1)

Table 2: Artix-7 FPGAs Devices Package Product Affected

Device Package-Pin

XC7A200T

FF(G)1156

(2)

FB(G)484

(3)

FB(G)676

(3)

SB(G)484

(3)

Table 3: Kintex-7 FPGAs Devices Package Product Affected

Device Package-Pin Device Package-Pin

XC7K70T

XC7K160T

FB(G)484

(3)

FB(G)676

(3)

FF(G)676

(2)

FB(G)484

(3)

FB(G)676

(3)

XC7K325T

XC7K355T

FF(G)676

(1)

FF(G)900

(1)

FB(G)676

(3)

FB(G)900

(3)

FF(G)901

(2)

Device

XC7K410T

Package-Pin

FF(G)676

(2)

FF(G)900

(2)

FB(G)676

(3)

FB(G)900

(3)

FF(G)901

(2)

FF(G)1156

(2)

FF(G)901

(2)

FF(G)1156

(2)

XC7K420T

XC7K480T

Table 4: Virtex-7 FPGAs Devices Package Product Affected

Device Package-Pin Device Package-Pin

XC7V585T

XC7VX330T

XC7VX415T

FF(G)1157

(2)

FF(G)1761

(2)

FF(G)1157

(2)

FF(G)1761

(2)

FF(G)1157

(2)

FF(G)1158

(2)

FF(G)1927

(2)

FF(G)1157

(2)

FF(G)1158

(2)

FF(G)1761

(2)

FF(G)1927

(2)

FF(G)1930

(2)

FF(G)1158

(2)

FF(G)1927

(2)

Device Package-Pin

FF(G)1157

(2)

FF(G)1158

(2)

FF(G)1761

(2)

FF(G)1926

(2)

FF(G)1927

(2)

FF(G)1930

(2)

FF(G)1926

(2)

FF(G)1928

(2)

FF(G)1930

(2)

XC7VX485T

XC7VX690T

XC7VX550T

XC7VX980T

XTP385 (v2.0) March 30, 2015

FAQ: Transition Schedule for Substrate Supplier for Virtex-6 and 7 Series FPGAs Flip Chip Packages

Table 5: Zynq-7000 FPGAs Devices Package Product Affected

Device

XC7Z030

Package-Pin

FB(G)484

(3)

FB(G)676

(3)

FF(G)676

(3)

SB(G)485

(3)

FB(G)676

(3)

FF(G)676

(3)

FF(G)900

(3)

Device

XC7Z045

Package-Pin

FB(G)676

(3)

FF(G)676

(3)

FF(G)900

(3)

Device

XC7Z100

Package-Pin

FFG1156

(3)

FFG900

(3)

XC7Z035

Notes:

(1)Please refer to Table 6 Phase 1 cross-ship schedule

(2)Please refer to Table 7 Phase 2 cross-ship schedule

(3)Please refer to Table 8 Phase 3 cross-ship schedule

*For inquiries about a specific part number, please contact your customer operations representative or CQE

representative for any additional questions.

Q: When will this change take effect?

This change will take effect in Q1, CY2015. At that time, Xilinx will start cross shipping all Virtex-6 product families

and selected 7 series FPGAs product families from UMTC. This will result in initial production device shipments to

customers in the timelines indicated in Table 6 and Table 7 and Table 8 below.

Table 6: Phase 1 - Virtex-6 and Kintex-7 Devices Qualification Completion and Cross-Ship Schedule

Device

XC6VCX130T

XC6VCX195T

XC6VCX240T

XC6VCX75T

XC6VHX250T

XC6VHX255T

XC6VHX380T

XC6VHX565T

XC6VLX130T

XC6VLX195T

XC6VLX240T

XC6VLX365T

XC6VLX550T

XC6VLX75T

XC6VLX760

XC6VSX315T

XC6VSX475T

XC7K325T

Qualification

Report Available

November 3

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PCN Approval

March 23

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Cross-Ship Date

March 24

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XTP385 (v2.0) March 30, 2015

FAQ: Transition Schedule for Substrate Supplier for Virtex-6 and 7 Series FPGAs Flip Chip Packages

XTP385 (v2.0) March 30, 2015

FAQ: Transition Schedule for Substrate Supplier for Virtex-6 and 7 Series FPGAs Flip Chip Packages

Revision History

The following table shows the revision history for this document:

Date

11/03/2014

11/10/2014

03/30/2015

Version

1.0

1.1

2.0

Initial release.

Description of Revisions

Minor update on Table 1 to remove FF(G)1759 package from XC6VCX240T device.

Added Zynq-7000 family, Artix-7 SB(G) and FB(G) package and Kintex-7 FB(G) package for

Phase 3 release.

XTP385 (v2.0) March 30, 2015