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2024年12月28日发(作者：aspnet页面间传值方法)
bga封装制造流程
English Answer:
Ball Grid Array (BGA) Manufacturing Process.
The ball grid array (BGA) is a type of surface-mount
packaging (SMP) for integrated circuits. BGAs are widely
used in high-performance electronic devices such as
computers, smartphones, and gaming consoles.
The manufacturing process of BGA involves several key
steps:
1. Wafer Fabrication: The integrated circuit (IC) is
fabricated on a silicon wafer using photolithography and
other semiconductor processing techniques.
2. Die Attach: The IC die is attached to a carrier
substrate, which provides electrical and mechanical support.
3. Wire Bonding: Thin gold wires are used to connect
the IC's terminals to the carrier substrate.
4. Substrate Processing: The carrier substrate is
processed to prepare it for the attachment of solder balls.
This includes cleaning, plating, and applying solder mask.
5. Solder Ball Placement: Solder balls are placed on
the exposed pads of the carrier substrate using a solder
paste stencil or a solder ball placement machine.
6. Reflow Soldering: The assembly is heated to a
temperature that melts the solder balls, forming permanent
electrical connections between the IC die and the carrier
substrate.
7. Molding: A protective molding compound is applied to
encapsulate the assembly, providing additional mechanical
strength and protection.
8. Testing and Inspection: The BGA package is tested
and inspected to ensure proper functionality and electrical
performance.
Chinese Answer:
球栅阵列（BGA）制造流程。
球栅阵列（BGA）是一种集成电路表面贴装封装（SMP）。BGA
广泛应用于计算机、智能手机和游戏机等高性能电子设备中。
BGA 的制造过程涉及几个关键步骤：
1. 晶圆制造，集成电路（IC）在硅晶圆上利用光刻和其他半导
体加工技术制造。
2. 芯片贴装，IC 芯片贴装在载体基板上，载体基板提供电气
和机械支撑。
3. 引线键合，使用细金线将 IC 的端子连接到载体基板上。
4. 基板处理，对载体基板进行处理，为其贴装焊球做好准备。
这包括清洁、电镀和施加阻焊层。
5. 焊球放置，使用焊膏模板或焊球放置机将焊球放置在载体基
板的裸露焊盘上。
6. 回流焊，将元件加热到使焊球熔化的温度，形成 IC 芯片和
载体基板之间的永久电气连接。
7. 模塑，施加保护模塑化合物以封装元件，提供额外的机械强
度和保护。
8. 测试和检验，对 BGA 封装进行测试和检验，以确保其正常
功能和电气性能。
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