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2024年12月28日发(作者：涉恶案件是不是不能减刑)
Microelectronics packaging technology
(Review contents)
Chapter 1： Introduction
1. The development characteristics and trends of microelectronics packaging.
2. The functions of microelectronics packaging.
3. The levels of microelectronics packaging technology.
4. The methods for chip bonding.
Chapter 2
：Chip interconnection technology
It is one of the key chapters
1. The Three kinds of chip interconnection, and their characteristics and applications.
2. The types of wire bonding (WB) technology, their characteristics and working principles.
3. The working principle and main process of the wire ball bonding.
4. The major materials for wire bonding.
5. Tape automated bonding (TAB) technology:
1）The characteristic and application of TAB technology.
2）The key materials and technologies of TAB technology.
3）The internal lead and outer lead welding technology of TAB technology.
6. Flip Chip Bonding (FCB) Technology
1）The characteristic and application of flip chip bonding technology
2）UBM and multilayer metallization under chip bump；UBM’s structure and material, and the roles of
each layer.
3）The main fabrication method of chip bumps.
4）FCB technology and its reliability.
5）C4 soldering technology and its advantages.
6）The role of underfill in FCB.
7）The interconnection principles for Isotropic and anisotropic conductive adhesive respectively.
Chapter 3: Packaging technology of Through-Hole components
1. The classification of Through-Hole components.
2. Focused on：DIP packaging technology, including its process flow.
3. The characteristics of PGA.
Chapter 4：Packaging technology of surface mounted device (SMD)
1. The advantages and disadvantages of SMD.
2. The types of SMD.
3. The main SMD packaging technologies, focused on：SOP、PLCC、LCCC、QFP.
4. The packaging process flow of QFP.
5. The risk of moisture absorption in plastic packages, the mechanism of the cracking caused by moisture
absorption, and solutions to prevent for such failure.
Chapter 5：Packaging technology of BGA and CSP
1. The characteristics of BGA and CSP.
2. The packaging technology for PBGA，and its process flow.
3. The characteristics of packaging technology for CSP.
4. The reliability problems of BGA and CSP.
Chapter 6： Multi-Chip Module（MCM）
1.
The classification and characteristics of MCM
2.
The assembly technology of MCM.
Chapter 7：Electronic packaging materials and substrate technology
1. The classification of the materials for electronic packaging, the main requirements for packaging
materials.
2. The types of metals in electronic packaging, and their main applications.
3. The main requirements for polymer materials in electronic packaging.
4.
Classification of main substrate materials, and the major requirements for substrate materials.
Chapter 8：Microelectronics packaging reliability
1.
The basic concepts of electronic packaging reliability.
2.
The basic concepts for failure mode and failure mechanism in electronic packaging.
3.
Main failure (defect) modes (types) of electronic packaging.
4.
The purpose and procedure of failure analysis (FA) ；Common FA techniques (such as cross section, dye
and pry, SEM, CSAM ...).
5 The purpose and key factors (such as stress level, stress type …) to design accelerated reliability test.
Chapter 9：Advanced packaging technologies
1. The concept of wafer level packaging (WLP) technology.
2. The key processes of WL-CSP.
3. The concept and types of the 3D packaging technologies.
Specified Subject 1：LED packaging technology
1. Describe briefly the four ways to achieve LED white light, and how they are packaged？
2. Describe briefly the difference and similar aspects (similarity) between LED packaging and
microelectronics packaging.
3. And also describe briefly the development trend for LED package technology and the whole LED industry
respectively.
Specified Subject 2：MEMS packaging technology
1. The differences between micro-electro-mechanical system (MEMS) packaging technology and the
conventional microelectronics packaging technologies.
2. The function requirements of MEMS packaging.
Extra requirement:
The common used terms (Abbreviation) for electronic packaging.
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