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PK618 (v1.1) April 3, 2015
100% Material Declaration Data Sheet for
7 Series RF900 Package
Average Weight: 9.8041 g
Component Substance
Description
CAS# or
Description
% of
Component
Use in Product Component Weight/
Substance Weight
(in grams)
0.297103
Component %
of Total
3.030%
Silicon Die
Silicon
Bump
Tin
Lead
Underfill
Bisphenol F/
Epichlorohydrin
Phenolic Resin
Bisphenol A Type
Liquid Epoxy
Resin
Amine Type
Accelerator
Silicon Dioxide
Carbon Black
Additives
Solder Paste
Tin
Lead
Capacitor 1
Barium
Manganese
Nickel
Copper
Boron
Nickel
Tin
Lead
12047-27-7
1313-13-9
7440-02-0
7440-50-8
1303-86-2
7440-02-0
7440-31-5
7439-92-1
88.86
1.43
4.29
0.70
0.01
3.57
0.90
0.24
Ceramic
Ceramic
Internal Electrode
Termination
Termination
Plating
Plating
Plating
7440-31-5
7439-92-1
63.00
37.00
Metal
Metal
9003-36-5
Trade Secret
25068-38-6
20.00
15.00
5.00
Basis
Basis
Basis
7440-31-5
7439-92-1
63.00
37.00
Basis
Basis
7440-21-3 100.00 Basis 0.297103
0.014081
0.008871
0.005210
0.045000
0.009000
0.006750
0.002250
0.459%
0.144%
Trade Secret
60676-86-0
1333-86-4
Trade Secret
5.00
51.50
1.00
2.50
Basis
Basis
Basis
Additive
0.002250
0.023175
0.000450
0.001125
0.006300
0.003969
0.002331
0.023400
0.020793
0.000334
0.001003
0.000164
0.000003
0.000836
0.000211
0.000057
0.239%
0.064%
PK618 (v1.1) April 3, 2013
100% Material Declaration Data Sheet – 7 Series RF900
Component Substance
Description
CAS Number or
Description
Percentage of
Component
Use in Product Component Weight/
Substance Weight
(grams)
0.004100
Component
Percent of
Total
0.042% Capacitor 2
Barium
Manganese
Nickel
Copper
Glass Oxide
Nickel
Tin
Lead
Capacitor 3
Barium
Manganese
Nickel
Copper
Boron
Nickel
Gold
Capacitor 4
Barium
Manganese
Nickel
Copper
Glass Oxide
Nickel
Tin
Lead
Heat Sink
Copper
Nickel
Nickel Sulfate
Heat Sink
Adhesive
Aluminium Oxide
AI203
Dimethyl Siloxane,
Dimethylvinyl-
terminated
1344-28-1 70.00 Main Material
7440-50-8
7440-02-0
7786-81-4
99.80
0.10
0.10
Main Material
Main Material
Main Material
12047-27-7
1313-13-9
7440-02-0
7440-50-8
65997-17-3
7440-02-0
7440-31-5
7439-92-1
72.40
10.60
4.00
5.80
0.20
2.66
3.99
0.35
Ceramic
Ceramic
Internal Electrode
Termination
Termination
Plating
Plating
Plating
12047-27-7
1313-13-9
7440-02-0
7440-50-8
1303-86-2
7440-02-0
7440-57-5
71.29
10.43
2.00
11.57
0.21
1.80
2.70
Ceramic
Ceramic
Internal Electrode
Termination
Termination
Plating
Plating
12047-27-7
1313-13-9
7440-02-0
7440-50-8
65997-17-3
7440-02-0
7440-31-5
7439-92-1
88.86
1.43
4.29
0.70
0.01
3.57
0.86
0.29
Ceramic
Ceramic
Internal Electrode
Termination
Termination
Plating
Plating
Plating
0.003643
0.000059
0.000176
0.000029
0.000001
0.000146
0.000035
0.000012
0.002500
0.001782
0.000261
0.000050
0.000289
0.000005
0.000045
0.000068
0.012880
0.009325
0.001365
0.000515
0.000747
0.000026
0.000343
0.000514
0.000045
5.818000
5.806364
0.005818
0.005818
0.120000
0.084000
1.224%
59.343%
0.131%
0.025%
68083-19-2 30.00 Main Material 0.036000
PK618 (v1.1) April 3, 2015
100% Material Declaration Data Sheet – 7 Series RF900
Component Substance
Description
CAS Number or
Description
Percentage of
Component
Use in Product Component Weight/
Substance Weight
(grams)
0.856618
Tin
Lead
Substrate
Copper
Tin
Lead
Silver
BT Core
ABF
Solder Mask
7440-50-8
7440-31-5
7439-92-1
7440-22-4
N/A
N/A
Trade Secret
40.10
0.82
0.17
0.02
43.50
13.14
2.25
7440-31-5
7439-92-1
63.00
37.00
Main Material
Main Material
0.539669
0.316949
2.604098
1.044296
0.021224
0.004427
0.000417
1.132886
0.342231
0.058617
26.561%
Component
Percent of
Total
8.737% Solder Ball
P618 (V1.1) April 3, 2015
100% Material Declaration Data Sheet – 7 Series RF900
Revision History
The following table shows the revision history for this document.
Date
09/17/13
04/03/15
Version
1.0
1.1
Description of Revisions
Initial Xilinx release.
Correct error in Solder Paste
Notice of Disclaimer
Xilinx regards this materials data to be correct but makes no guarantee as to its
accuracy or completeness, including, but not limited to, with respect to its
compliance with applicable environmental laws and regulations. Xilinx
subcontracts the production, test and assembly of hardware devices to
independent third-party vendors and materials suppliers (“Contractors”). All data
provided hereunder is based on information received from Contractors. Xilinx
has not independently verified the accuracy or completeness of this information
which is provided solely for your reference in connection with the use of Xilinx
products
.
PK618 (v1.1) April 3, 2015
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