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2024年12月28日发(作者：openstack四个应用)

专利内容由知识产权出版社提供

专利名称：Substrate transfer apparatus

发明人：Yasuhiko Okugi

申请号：US09654566

申请日：20000901

公开号：US06379103B1

公开日：20020430

专利附图：

摘要：The present invention provides a substrate transfer apparatus which can hold

the substrate without contacting the surface of the substrate while the substrate is

transferred and which does not require the additional prealignment mechanism. The

substrate is transferred by a handler. The handler comprises a substrate holding

apparatus and a substrate contact apparatus. The substrate holding apparatus includes a

noncontact chuck for holding the substrate without contacting the surface of the

substrate, and an elevating mechanism for lowering and lifting the noncontact chuck. The

substrate contact apparatus includes a contact member to be in contact with the end

face of the substrate, a moving mechanism for moving the contact member away from

the end face of the substrate when the noncontact chuck is lowered and moving the

contact member towards the end face of the substrate when the noncontact chuck is

lifted. The handler comprise the appropriate number of the substrate holding apparatus

and the appropriate number of the substrate contact apparatus.

申请人：ORC MANUFACTURING CO., LTD.

代理机构：Liniak, Berenato, Longacre & White

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