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2024年12月28日发(作者：device名词)

专利内容由知识产权出版社提供

专利名称：Substrate split device

发明人：増栄 洋

申请号：JP実願平4-23753

申请日：19920414

公开号：JP実開平5-80699U

公开日：19931102

专利附图：

摘要：(57)< Abstract > < Objective > Without giving damage and the damage to the

implemental part, efficientAt the same time without giving the deformation and

deformation of the substrate, multiple substrate phasesIt can separate and disconnect

the sheet of the long shaku condition where this section is formedThe substrate body is

offered. < Constitution > shi of the long shaku condition which possesses the substrate

suitable section for substrate formationto configuration body 12 rotary blade

engagement of 10 of pair and 11Making the section pass, regarding to the device which it

splits separates, the said rotary blade 1In the vicinity of 0 and 11, substrate conveying

means 3 to be provided,At the same time as for the said substrate conveying means 3,

the sheet structure for the said substrate which is splitStructure body 12 paralleling to

the specified aspect, particular rotary blade 10 and 11Way it can supply to engagement

section Z, particular substrate conveying means 3Position of the aisle of the sheet

structure for the said substrate is adjustedThe substrate split equipment which includes

substrate conveying means position adjusting device 32Position.

申请人：富士通テン株式会社

地址：兵庫県神戸市兵庫区御所通1丁目2番28号

国籍：JP

代理人：青木 朗 (外4名)

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