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2024年12月29日发(作者：springcloud打jar引用问题)
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专利名称：Base plate for use in a multi-chip module
发明人：Jing Shi,Nyles Nettleton,Bruce M. Guenin
申请号：US12646660
申请日：20091223
公开号：US08164917B2
公开日：20120424
专利附图：
摘要：A base mechanism for use in a multi-chip module (MCM) is described. This base
mechanism includes a substrate having top and bottom surfaces. The bottom surface
includes first electrical connectors that convey power, and through-substrate vias (TSVs)
between the top and bottom surfaces are electrically coupled to these electrical
connectors. Furthermore, a bridge chip is rigidly mechanically coupled to the top surface.
This bridge chip includes proximity communication connectors that communicate
information via proximity communication with one or more island chips in the MCM.
Additionally, spacers are rigidly mechanically coupled to the top surface of the substrate.
In conjunction with the bridge chip, the spacers define cavities on the top surface, which
include second electrical connectors. These second electrical connectors are electrically
coupled to the TSVs, and communicate additional information with and convey power to
the one or more island chips.
申请人：Jing Shi,Nyles Nettleton,Bruce M. Guenin
地址：Carlsbad CA US,Cupertino CA US,San Diego CA US
国籍：US,US,US
代理机构：Park, Vaughan, Fleming & Dowler LLP
代理人：Steven E. Stupp
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